Critique of dielectric cure monitoring in epoxy resins – Does the method work for commercial formulations?
Source abstract
Abstract
Dielectric techniques can be used as an in situ monitor of resin cure. This study reports measurements on two commercial resin formulations and aims to establish the extent to which identifiable turning points in the dielectric behaviour are dependent of the formulation used. Complementary curometer and differential scanning calorimetry data are used to monitor the progress of cure and are compared with the dielectric data. System [A] is a simple epoxy amine system, whilst system [B] is a blend of both epoxy and amine resins. It is clear that without calibration of the dielectric data against other methods it is difficult to unambiguously derive absolute cure information on a system not previously studied. However, dielectric data does allow identification of the points at which gelation and vitrification occur and demonstrates its utility as an in situ monitoring method for the cure process.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Epoxy Resin Curing Processes · Synthesis and properties of polymers · Mechanical Behavior of Composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (34)
Show source-provided references
1. In-situ curing strain monitoring of a flat plate residual stress specimen using a chopped stand mat glass/epoxy composite as test material10.1007/s10443-015-9437-4 ↗
2. Exploring equivalence of information from dielectric and calorimetric measurements of thermoset cure—a model for the relationship between curing temperature, degree of cure and electrical impedance10.1016/j.polymer.2005.05.005 ↗
3. Determination of the degree of cure under dynamic and isothermal curing conditions with electrical impedance spectroscopy10.1002/polb.10676 ↗
4. Cure kinetics, glass transition temperature development and dielectric spectroscopy of a low temperature cure epoxy/amine system10.1002/app.34605 ↗
5. Vitrification during the Isothermal cure of thermosets: comparison of theoretical simulations with temperature-modulated DSC and dielectric analysis10.1002/macp.200800217 ↗
6. Monitoring the production of FRP composites: a review of in-line sensing methods10.3144/expresspolymlett.2014.84 ↗
7. Garden LH, Hayward D, Pethrick RA. Dielectric non-destructive testing approach to cure monitoring of adhesives and composites, Proc. IMechE 221G: J. Aerospace Eng: p. 521–3310.1243/09544100JAERO158 ↗
8. Dielectric, mechanical and rheological studies of phase-separation and cure of a thermoplastic modified epoxy-resin – incorporation of reactively terminated polysulfones10.1016/0032-3861(93)90399-U ↗
9. MacKinnon AJ, Jenkins SD, McGrail PT, Pethrick RA, Hayward D, Delides CG, Vatalis AS. Dielectric and rheological studies of crosslinking in phase separating systems. ICCP’92 Conference, Noordwijk, Holland; 1992.
10. A dielectric mechanical, rheological and electron microscopy study of cure and properties of a thermoplastic modified epoxy resin
11. Real time dielectric measurements of network formation in crosslinked epoxy resin systems
12. Real time dielectric investigations of phase separation and cure in rubber modified epoxy resin systems10.1016/0014-3057(92)90125-L ↗
13. Dielectric and morphological investigation of phase separation and cure in rubber modified epoxy resins: comparison between TETA and DDM based systems10.1002/app.1993.070471114 ↗
14. Delides CG, Vatalis AS, Pissis P, Pethrick RA. Dielectric TSDC and phase separation studies of rubber modified epoxy resin networks. Macro92 Conference, Praga; 1992.
15. Real time dielectric relaxation studies of dynamic polymeric systems10.1016/S0079-6700(02)00027-8 ↗
16. Dielectric and steric hindrance effects on step-polymerization of a diepoxide with monoamines10.1039/ft9949000883 ↗
17. Real time dielectric spectroscopy and bond connectivity during polymerization of stoichiometric and amine-rich, diepoxide.diamine compositions10.1039/a800277k ↗
18. Prediction of the rheological properties of a curing thermoset system10.1021/ma3023266 ↗
19. Solvent effects on cure 1-benzyl alcohol on epoxy cure10.1080/00914037.2010.531813 ↗
20. A versatile method of characterizing cure in filled reactivepolymer systems
21. Rheological studies of the cure of epoxy/polyester powder coatings containing titanium dioxide10.1007/s11998-012-9417-7 ↗
22. Influence of nanosilica particles on the cure and physical properties of an epoxy thermoset resin10.1002/pi.2714 ↗
23. Chapter 3: rheological studies using a vibrating probe
24. Standards, calibration, and guidelines in microcalorimetry, Part 2: calibration standards for differential scanning calorimetry10.1351/pac200678071455 ↗
25. Chapter 14: physical and chemical characterisation of epoxy resins
26. Williams · 1995
27. Campbell · 2000
28. Potter · 1970
29. Lee HN. Epoxy resins: their applications and technology; 1957.
30. Chapter 1: introduction to the chemistry, synthesis, manufacture and characterisation of epoxy resins
31. Chapter 4: additives and modifiers for epoxy resins
32. Dielectric properties of phase separated polymer solids: 1. Styrene-butadiene-styrene triblock copolymers10.1016/0032-3861(78)90198-2 ↗
33. Dielectric studies of heterogeneous phase polymer systems: poly(ethylene oxide) inclusions in polycarbonate - a model system10.1021/ma00031a019 ↗
34. Dielectric properties of phase separated polymer solids: 2. Butanediol terephthalate-poly(tetramethylene oxide terephthalate) copolymers10.1016/0032-3861(78)90199-4 ↗