FE simulation of the curing behavior of the epoxy adhesive Hysol EA-9321
Source abstract
Abstract
Cold-curing adhesives, characterized by an unsteady curing degree, present various advantages for assembling large scale structures set up under outdoor conditions. Thus various applications can be found in aerospace and automotive industries where structures are affected by thermal and mechanical loads. Hence, the curing state of the adhesive must be known to evaluate the lifetime of such bonded structures. The evolution of the polymerization of the adhesive Hysol EA-9321 during the curing process was examined in this paper. To that end, the curing degree of the adhesive was experimentally and analytically investigated for different curing cycles with a view to a potential application in the aerospace domain, where structures are assembled at low temperatures. Existing dynamic and isothermal curing models were applied to simulate the curing behavior of the adhesive. Then, an FEM model was developed to simulate the process of adhesive curing by taking into account a thermo-kinetic coupling.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Epoxy Resin Curing Processes · Injection Molding Process and Properties · Thermal and Kinetic Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (31)
Show source-provided references
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