Wettability and adhesion characteristics of photo-crosslinkable adhesives for thin silicon wafer

Abstract Acrylic pressure-sensitive adhesives (PSAs) have many applications in the processes of electronic industry. As the silicon wafers become thinner, the acrylic PSAs need to show proper adhesion and better wettability on the thin wafer. The acrylic copolymers were synthesized by solution polymerization of 2-ethylhexyl acrylate, ethyl acrylate, and acrylic acid with AIBN as an initiator. Photo-crosslinkable PSAs were synthesized by reaction of the acrylic copolymers with glycidyl methacrylate (GMA) and lauryl glycidyl ether (LGE). The adhesion performance of acrylic photo-crosslinkable PSAs was investigated based on wettability, probe tack, peel strength, cohesiveness, and viscoelastic properties. The adhesion characteristics varied significantly depending on the ratio of GMA to LGE in the photo-crosslinkable PSAs.