journal article·1990-10

Effects of curing conditions and test temperatures on the strength of adhesive-bonded joints

K. Matsui

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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Mechanical Behavior of Composites · Epoxy Resin Curing Processes · Synthesis and properties of polymers

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (8)

Show source-provided references
1. Size-effects on average ultimate shear stresses of adhesive-bonded rectangular or tubular lap joints under tension-shear10.1016/0143-7496(90)90147-P ↗
2. Molecular design of adhesives, part 1. Epoxide resin as a model of thermosetting adhesives
3. DeLollis · 1970
4. Hartshorn · 1986
5. Tsukada · 1976
6. Yamaguchi · 1981
7. Effect of curing condition and test temperature on shear strength on adhesive and adhesive-bonded joints
8. Effect of curing condition and test temperature on strength of α-cyanoacrylate and adhesive-bonded joint