Bonding of thermoplastic microfluidic device by water assistance
Source abstract
Abstract
We present a water-assisted microwave bonding (H 2 O-μWave bonding) process for sealing thermoplastic microfluidic devices. We use water as the bonding reagent to assist the formation of covalent bonds after surface activation and water evaporation procedures. In surface activation step, we exam UV/Ozone and O 2 plasma surface treatments and their effects of the surface wettability, optical transmissivity, surface morphology, and surface chemistry on a polymethyl methacrylate (PMMA) substrate in H 2 O-μWave bonding. After surface activation, water evaporation step was performed to form the bonds. The bonding can be simply formed by leaving the surface-activated pair in the room environment after water application. We examined the bonding strength and coverage of PMMA by both room temperature drying and microwave annealing approaches in H 2O-μWave bonding. Finally, stability and multilayer bonding were also tested to evaluate the quality of H 2O-μWave bonding.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Microfluidic and Capillary Electrophoresis Applications · Nanofabrication and Lithography Techniques · Innovative Microfluidic and Catalytic Techniques Innovation
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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