A study of the thermal properties of alumina/glycidoxy propyl POSS/epoxy adhesives
Source abstract
Abstract
The nanoparticles of glycidoxy propyl POSS (GPOSS) and alumina microparticles were added into a two-part epoxy adhesive. The filler dispersion in adhesive samples were characterized by EDXA and SEM micrographs indicating weaker dispersion for the highly loaded alumina and/or GPOSS filled compositions. Comparing with neat epoxy resin, DSC thermograms revealed lower heat of cure and higher onset cure temperatures in all compositions. The highest glass transition temperature ( T g ) was obtained for the composition containing 10 wt% alumina microparticles and 20 wt% GPOSS, which was about 44 °C higher than that of the neat epoxy. The thermal stability of this composition was improved up to 7 °C based on the first decomposition peak temperature in a TGA test. However, the highest char yield obtained from the TGA test was recorded for a composition containing 20 wt% alumina microparticles and 10 wt% GPOSS. Adhesive lap shear strength values showed a maximum of 13.2 MPa (>40% than epoxy) for the composition containing 10 wt% alumina microparticles and 10 wt% GPOSS. The improvement in adhesive thermal stability was further verified by the results of adhesive strength retention after heat aging at 200 °C for 24 h. It can be concluded that the simultaneous incorporation of GPOSS and alumina in an epoxy results in noticeable improvements in T g , thermal stability and adhesion strength, mainly due to improved interfacial interactions between GPOSS and alumina particles.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Silicone and Siloxane Chemistry · Epoxy Resin Curing Processes · Synthesis and properties of polymers
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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