Curing behavior of soy flour with phenol-formaldehyde and isocyanate resins
Source abstract
Abstract
Abstract Cost savings are realized when phenol formaldehyde (PF) and polymeric methylene diphenyl diisocyanate (pMDI) resins are partially substituted with soy flour during the manufacture of engineered woods such as oriented strand board. The interaction of soy flour with the two resins was studied through thermogravimetric analysis, Fourier transform infrared spectroscopy, and mass spectroscopy. No significant differences in the results from all three analyses were observed between neat PF and PF resin partially (up to 30%) substituted with soy flour, suggesting that chemical bonding between soy flour and PF resin was minimal. In contrast, soy flour induced major changes in the thermogravimetric and spectroscopic properties when substituted in pMDI resin because of chemical cross-linking between the two species.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Lignin and Wood Chemistry · Natural Fiber Reinforced Composites · Wood Treatment and Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (25)
Show source-provided references
1. Soy-substituted liquid phenol formaldehyde binders for flakeboard10.1007/s00107-016-1114-2 ↗
2. The effect of surfactants on the solubility, zeta potential, and viscosity of soy protein isolates10.1016/S0268-005X(03)00047-X ↗
3. Banerjee S, Li D Interpreting multicomponent infrared spectra by derivative.
4. Lignin determination by FT-IR10.1366/0003702924125456 ↗
5. Reaction kinetics in differential thermal analysis10.1021/ac60131a045 ↗
6. Soy-based adhesives for wood-bonding – a review10.1080/01694243.2016.1237278 ↗
7. Li K US patent 7,722,712.
8. Investigation of soy protein-kymene adhesive systems for wood composites10.1007/s11746-004-0928-1 ↗
9. Cowan J, Atkinson DL, Breyer RA, Rivers JD, Vest CE. Protein-modified isocyanate-functional adhesive binder for cellulosic composite materials. US patent Appl 2006/0231968A1; 2006.
10. Simulation and optimization of the continuous oriented strand board pressing process10.1021/ie058051y ↗
11. Soy flour detackification of stickies from paper recycling10.3183/NPPRJ-2015-30-03-p541-545 ↗
12. Chang · 2013
13. Via B, Banerjee S Soy-modified resins for bonding wood, US patent pending.
14. Diphenylmethane diisocyanate self-polymerization: thermal hazard evaluation and proof of runaway reaction in gram scale10.1016/j.jlp.2010.07.001 ↗
15. Bond quality of soy-based phenolic adhesives in Southern pine plywood10.1007/s11746-006-1198-7 ↗
16. Kuo M, Meyers DJ, Heemstra H, Curry D, Adams DO, Stokke DD. Soybean-based adhesive resins and composite products utilizing such adhesives. US patent 6,518,387 B2; 2003.
17. Analysis of soy flour/phenol-formaldehyde adhesives for bonding wood
18. Chromatographic analysis of the reaction of soy flour with formaldehyde and phenol for wood adhesives10.1007/s11746-007-1097-6 ↗
19. Carbon 13 nuclear magnetic resonance studies on formaldehyde reactions with polyfunctional amino-acids
20. Hand · 2018
21. Thermal degradation of lignin-phenol-formaldehyde and phenol-formaldehyde resol resins: structural changes, thermal stability, and kinetics10.1007/s10973-011-1405-0 ↗
22. Phenol-formaldehyde resin curing and bonding in steam-injection pressing. I. Resin synthesis, characterization, and cure behavior10.1002/app.1991.070430203 ↗
23. Curing kinetics of phenol formaldehyde resin and wood-resin interactions in the presence of wood substrates10.1007/s00226-003-0221-5 ↗
24. Critical variables in the rapid cure and bonding of phenolic resins
25. Interfacial factors affecting polymeric diphenylmethane diisocyanate/wood bond strength10.1002/app.21946 ↗