Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package
Source abstract
Abstract
Abstract In this study, we used 3-aminopropyltrimethoxysilane, hexanedioic acid, 3-mercaptopropyltrimethoxysilane, and thioglycolic acid to functionalize the surface of micro silver flakes through in-situ replacements. Hexanedioic acid had the best effect on the functionalization. When the content of hexanedioic acid was 0.5–1 wt% of micro silver flakes, it could fully replace the long chain fatty acid and form a very thin molecular film on the surface of micro silver flakes. The micro silver flakes functionalized by hexanedioic acid played a significant role in the regards of improving the properties of electrically conductive adhesives, and letting the adhesives have low viscosity, e.g., 28,000 cPs, low bulk resistivity, e.g., 2.4×10 −4 Ω cm, and high shear strength, e.g, 10.4 MPa.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Nanomaterials and Printing Technologies · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (32)
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