Viscoelastic model to capture residual stresses in heat cured dissimilar adhesive bonded joints

Abstract The thermal loading during the curing process of an adhesive-bonded joint induces residual stresses in the joint, thereby affecting its performance. The problem becomes worse in the case of a multi-material joint involving varying coefficients of thermal expansion (CTE) for different parts. A novel approach was developed to model the properties of automotive grade structural adhesives during the heat curing process. The material model was divided into two components: curing kinetics model and viscoelastic mechanical model. The models were calibrated using experimental data from Differential Scanning Calorimetry (DSC) and Dynamic Mechanical Analysis (DMA) tests performed on an epoxy-based single-component adhesive. The calibrated material model parameters were fed into a finite element simulation and the prediction results were compared to a unique set of experiments utilizing two substrate combinations of adhesive-bonded single lap shear joints. An excellent agreement between the simulated and experimental results (displacement across the bond, force applied by the adhesive) was achieved. The modeling results give a better understanding of the residual stresses and agree with the experimental trend on the effect of bondline thickness on the joint.