High-strain shape memory polymers as practical dry adhesives

Abstract The adhesive benefits of incorporating shape memory polymers (SMPs) in various dry adhesive designs have been well documented in recent years. Chemically-crosslinked SMPs can possess remarkable shape fixity and recovery ability, chemical and thermal stability, a sharp glass transition, and other desirable qualities. However, low failure strain and a relatively rigid rubbery state limit their performance as a dry adhesive component in many practical applications. This work explores the adhesive benefits of using an epoxy-based SMP which has been modified to possess a softer rubbery state and a greatly increased maximum strain before failure. One of the modified SMPs forms the active adhesive surface of a prototype consumer level device.