Curing mechanism of triglycidylamine crosslinked soybean protein adhesive analyzed by Fourier transform infrared, second derivative infrared and two-dimensional correlation spectroscopy
Source abstract
Abstract
Abstract Triglycidylamine (TGA) modified soybean protein isolate (SPI) adhesive can increase the bonding strength of soy protein and improve its utilization. In order to study the chemical changes of TGA modified SPI adhesives during the heating process, the curing mechanism of soybean protein adhesives was studied by Fourier transform infrared (FTIR), second derivative infrared (SDIR) and two-dimensional correlation spectroscopy (2D-COS). With the increase of temperature, there were significant differences in the absorption peaks at 1075 cm−1, 1169 cm−1, 1390 cm−1, 1735 cm−1 indicating the active functional groups bared and reacted in the modified SPI, which formed hydrophobic ester, amide groups. Besides, some functional groups were dismissed or weakened such as N–H and –CH2- at 3440 cm−1 and 2847 cm−1 respectively. The epoxy ring of TGA opened to cross-link with the amino and hydroxyl groups within the molecular structure of SPI. The addition of TGA can effectively improve the molecular weight of soybean protein and form a network structure, which provides a method for improving the performance of a soybean protein adhesive.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: biodegradable polymer synthesis and properties · Lignin and Wood Chemistry · Proteins in Food Systems
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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