Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution
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OpenAlex topics: Electronic Packaging and Soldering Technologies · Nanomaterials and Printing Technologies · Nanofabrication and Lithography Techniques
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References (29)
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1. Weldability of iron-based powder metal materials using pulsed plasma arc welding process10.1016/j.jmatprotec.2007.07.007 ↗
2. Direct welding of different metals used ultrasonic vibration10.1016/j.jmatprotec.2008.03.006 ↗
3. Weldability and mechanical properties of dissimilar aluminum–copper lap joints made by friction stir welding10.1016/j.jallcom.2009.10.127 ↗
4. Survey of processes for joining and cutting materials
5. Wettability and strength of In–Bi–Sn lead-free solder alloy on copper substrate10.1016/j.jallcom.2010.07.182 ↗
6. Kinetics of intermetallic phase formation at the interface of Sn–Ag–Cu–X (X=Bi, In) solders with Cu substrate10.1016/j.jallcom.2011.03.164 ↗
7. Interface between Sn–Sb–Cu solder and copper substrate10.1016/j.msea.2011.04.008 ↗
8. Electron-diffraction study of liquid–solid transition of thin metal films10.1143/JPSJ.9.359 ↗
9. Nanoparticulate materials densification10.1016/S0965-9773(96)00046-3 ↗
10. Metal–metal bonding process using Ag metallo-organic nanoparticles10.1016/j.actamat.2005.01.047 ↗
11. Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material10.1109/TCAPT.2005.853167 ↗
12. Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly10.1109/TDMR.2006.882196 ↗
13. Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages10.1016/j.microrel.2009.05.004 ↗
14. A low-temperature bonding process using mixed Cu–Ag nanoparticles10.1007/s11664-010-1195-3 ↗
15. Study of bonding technology using silver nanoparticles10.1143/JJAP.47.6615 ↗
16. Interfacial bonding mechanism using silver metallo-organic nanoparticles to bulk metals and observation of sintering behavior10.2320/matertrans.MF200805 ↗
17. Low-temperature bonding using silver nanoparticles stabilized by short-chain alkylamines10.1143/JJAP.48.125004 ↗
18. Optimal design of coating material for nanoparticles and its application for low-temperature interconnection10.1007/s11051-009-9775-y ↗
19. Bonding technique using micro-scaled silver-oxide particles for in-situ formation of silver nanoparticles10.2320/matertrans.MRA2008269 ↗
20. Direct bonding to aluminum with silver-oxide microparticles10.2320/matertrans.MRP2008277 ↗
21. Yasuda Y, Ide E, Morita T. Direct bonding to aluminum utilizing silver oxide particles. In: Proceedings of the 15th symposium on “microjoining and assembly technology in electronics”, p. 189–94 [in Japanese].
22. Bonding technique using micro-scaled silver-oxide particles10.5104/jiep.12.110 ↗
23. Development of lead free bonding technique corresponding to high temperature environment using micro-scaled silver-oxide particles10.2320/materia.49.20 ↗
24. Silica-coating of metallic copper nanoparticles in aqueous solution10.1016/j.colsurfa.2007.11.009 ↗
25. Synthesis of metallic copper nanoparticles coated with polypyrrole10.1007/s00396-009-2047-7 ↗
26. Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties10.1016/j.solidstatesciences.2010.12.025 ↗
27. Experimental correlations of pH and ionic strength effects on the colloidal fouling potential of silica nanoparticles in crossflow ultrafiltration10.1016/j.memsci.2007.06.072 ↗
28. AFM interaction study of α-alumina particle and c-sapphire surfaces at high-ionic-strength electrolyte solutions10.1016/j.jcis.2006.11.010 ↗
29. Electrical double layers' interaction between oppositely charged particles as related to surface charge density and ionic strength10.1016/j.colsurfa.2008.05.023 ↗