journal article·2026

Fabrication of High-Conductive and Reliable Embedded Circuits in Glass Substrates via Pressure-Assisted Cu Nanoparticle Sintering

Guannan Yang, Dongchang Ma, Junyi Lu, Weiqiang Li, Chao Tang, Wenzhe Wang, Qiyuan Zhang, Yu Zhang, Guanghan Huang, Chengqiang Cui

Publisher page

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Nanomaterials and Printing Technologies · Electronic Packaging and Soldering Technologies · Nanofabrication and Lithography Techniques

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Electromechanical Engineering, State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, China

Funding

National Natural Science Foundation of China · Guangdong S&T Programme · Science and Technology Program of Guangzhou

References

Reference metadata was not supplied for this record.