journal article·2023-12Open access

Robust Ultrahigh‐Q Quasi‐Bound States in the Continuum in Metasurfaces Enabled by Lattice Hybridization

Xiaoqing Luo, Yingying Han, Xiang Du, Shuai Chen, Guangyuan Li

Advanced Optical Materials· Volume 11· Issue 24

Abstract

Abstract Bound states in the continuum (BICs) have been of growing interest in photonics for their infinite quality factors and strong field localization. The last decade has witnessed great progress on the highest achievable quality factors of quasi‐BICs. However, it remains challenging to realize robust high‐Q quasi‐BICs that are tolerant to the parameter perturbation. Here, it is demonstrated that silicon metasurfaces formed by the hybridization of two lattices can support robust quasi‐BICs with the highest measured quality factor reaching 4130 and the minimum one larger than 1024, even when the relative displacement varies over the whole range of all the possible values. Taking advantage of the two in‐plane mirror‐symmetry points, for the first time, the transition between a toroidal dipole BIC and an electric quadrupole BIC, which guarantees robust ultrahigh‐Q quasi‐BICs at Γ point, is reported. The minimum quality factors of quasi‐BICs can be further improved significantly by shrinking the meta‐atom size and are immune from the intrinsic absorption loss of silicon in the visible regime. It is envisioned that this study will pave the way for achieving robust ultrahigh‐Q metasurfaces and boost their applications in lasing, nonlinear optics, and biosensing.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Metamaterials and Metasurfaces Applications · Plasmonic and Surface Plasmon Research · Optical Coatings and Gratings

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

CAS Key Laboratory of Human‐Machine Intelligence‐Synergy Systems Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences 518055 Shenzhen China

College of Physics and Electronic Information Anhui Normal University Wuhu 241000 China

Tianjin H‐Chip Technology Group Corporation Tianjin 300467 China

Shenzhen College of Advanced Technology University of Chinese Academy of Sciences Shenzhen 518055 China

Funding

Science and Technology Planning Project of Shenzen Municipality · National Natural Science Foundation of China · Natural Science Foundation of Guangdong Province

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