High thermal conductive diamond/Ag–Ti composites fabricated by low-cost cold pressing and vacuum liquid sintering techniques
Source abstract
Abstract
Abstract Diamond/Ag–Ti composites were fabricated by a low-cost liquid sintering technique. The Ti addition can effectively improve wetting and promote penetration in composite pores during liquid sintering. The interface structure of the diamond/Ag–Ti composite was identified as Ag/TiC/Ag–Ti/diamond. A high thermal conductivity of 719 W/mK was obtained for the 50 vol.% diamond/Ag-1 at.% Ti composite. Using a bimodal mixture (60 vol.% 150 μm + 10 vol.% 50 μm diamond/Ag-2 at.% Ti composite), a low coefficient of thermal expansion of 6.3 × 10 − 6 /K still with high thermal conductivity of 687 W/mK was achieved. These composites have potential applications for thermal management of high integration electronic devices.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Thermal properties of materials · Advanced ceramic materials synthesis · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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