Uncovering the multi-stage evolution process and corrosion failure mechanism of typical electronic interconnections in condensation environments
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OpenAlex topics: Electrical Contact Performance and Analysis · Copper Interconnects and Reliability · Hydrogen embrittlement and corrosion behaviors in metals
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References (52)
Show source-provided references
1. Formation of Ag dendrites: selective oxidation of Ag3Sn and its electrochemical migration in halogen-containing media10.1016/j.corsci.2025.113087 ↗
2. Electrochemical migration study on Sn-58Bi lead-free solder alloy under dust contamination10.3390/ma17215172 ↗
3. Shape synergy of Ag@ Cu chip packaging nano-paste and its sintering reliability10.1002/adem.202401906 ↗
4. Dynamic characteristics and mechanism of ions migration and dendrites evolution on the printed circuit board surface10.1016/j.expthermflusci.2024.111390 ↗
5. Herzberger J.L., Dasgupta A., Das S. Multiphysics study of electrochemical migration in ceramic capacitors[C]//2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. IEEE, 2015: 1-6.10.1109/EuroSimE.2015.7103154 ↗
6. Residue-assisted water layer build-up under transient climatic conditions and failure occurrences in electronics10.1109/TCPMT.2020.3005933 ↗
7. Transient risk of water layer formation on PCBAs in different climates: Climate data analysis and experimental study10.1016/j.microrel.2022.114655 ↗
8. Temperature-Humidity-Bias testing and life prediction modeling for electrochemical migration in Aerosol-Jet printed circuits10.1115/1.4063541 ↗
9. Electrolyte migration through electrochemical membranes: Potential source of error in batch electrochemical cells10.1002/cjce.25112 ↗
10. Mass transport in chalcogenide electrolyte films–materials and applications10.1016/j.jnoncrysol.2005.11.065 ↗
11. Analysis of the influence and mechanism of the pollution condensation environment on the electrochemical migration behaviour of printed circuit board with immersion silver10.1016/j.corsci.2024.112076 ↗
12. Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates10.1007/s10854-013-1095-4 ↗
13. Self-adaptive liquid film: dynamic realization of Dendrite-Free Zn deposition toward ultralong-life aqueous Zn battery10.1002/smll.202306195 ↗
14. A novel test circuit for automatically detecting electrochemical migration and conductive anodic filament formation10.1007/s11664-999-0151-6 ↗
15. Failure model for silver electrochemical migration10.1109/TDMR.2007.891531 ↗
16. situ optical inspection of electrochemical migration during THB tests10.1007/s10854-010-0198-4 ↗
17. Propensity of copper dendrite growth on subassembly package components used in quad flat package10.1109/TDMR.2008.919578 ↗
18. Reliability of printed circuit boards containing lead-free solder in aggressive environments10.1007/s10854-010-0150-7 ↗
19. Reliability of printed circuit boards processed using no-clean flux technology in temperature–humidity–bias conditions10.1109/TDMR.2008.922908 ↗
20. Solder flux residues and humidity-related failures in electronics: relative effects of weak organic acids used in no-clean flux systems10.1007/s11664-014-3609-0 ↗
21. Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions10.1016/j.mee.2008.03.015 ↗
22. Effect of surface finish material on printed circuit board for electrochemical migration10.1016/j.microrel.2007.09.006 ↗
23. Effect of the composition of Sn-Pb alloys on the microstructure of filaments and the electrochemical migration characteristics10.1007/s12540-011-0814-8 ↗
24. Difference of potential range formed at the anode between water drop test and temperature humidity bias test to evaluate electrochemical migration of solders for printed circuit board
25. Test methods for electrochemical migration: a review10.1007/s10854-016-5713-9 ↗
26. Evidence for Ag participating the electrochemical migration of 96.5 Sn-3Ag-0.5 Cu alloy10.1016/j.corsci.2019.05.004 ↗
27. Effect of Nd addition on the corrosion behavior of SAC305 solder alloy10.1016/j.corsci.2023.111264 ↗
28. Study on corrosion behavior of β-Sn and intermetallic compounds phases in SAC305 alloy by in-situ EC-AFM and first-principles calculation10.1016/j.corsci.2021.109244 ↗
29. A novel research for restraining the condensation of radiant air conditioner by superhydrophobic surface10.1016/j.enbuild.2023.113398 ↗
30. Beysens · 2022
31. Effect of bias voltage on the acceleration of anodic dissolution of SAC305 alloy10.1016/j.jallcom.2025.180866 ↗
32. Effect of passivation behavior of SAC305 alloy on the structure and defects of surface oxide film10.1016/j.apsusc.2024.161778 ↗
33. Generation, migration, and coalescence of droplets: A state-of-the-art review from the perspectives of wettability, inertia, and electric field10.1063/5.0241194 ↗
34. Wetting and coalescence of the liquid metal on the metal substrate10.1088/1674-1056/26/8/083104 ↗
35. Coalescence Mechanism Induced by Different Wetting States of Ti and Al Droplets on Rough Surfaces10.1021/acs.langmuir.4c02841 ↗
36. Electrochemical migration of nano-sized Ag interconnects under deionized water and Cl−-containing electrolyte10.1007/s10854-018-9947-6 ↗
37. Insight into atomic H* generation, H2 evolution, and cathode potential of MnO2 induced Pd/Ni foam cathode for electrocatalytic hydrodechlorination10.1016/j.cej.2019.05.171 ↗
38. Deterministic Formation and Growth of Dendritic Crystals of Attractive Colloids10.1002/smll.202311543 ↗
39. Orientation selection in dendritic evolution10.1038/nmat1693 ↗
40. Polymer encapsulants for microelectronics: mechanisms for protection and failure10.1109/33.2979 ↗
41. Titus R., Gerhardt R., Fowler J.E. Effect of Humidity on the Electrical Response of Interdigitated Circuit Patterns[C]//Electrochemical Society Meeting Abstracts 242. The Electrochemical Society, Inc., 2022 (6): 595-595.10.1149/MA2022-026595mtgabs ↗
42. Tencer M. Moisture ingress into nonhermetic enclosures and packages. A quasi-steady state model for diffusion and attenuation of ambient humidity variations[C]//1994 Proceedings. 44th Electronic Components and Technology Conference. IEEE, 1994: 196-209.10.1109/ECTC.1994.367630 ↗
43. Selective corrosion of β-Sn and intermetallic compounds in an Ag–Sn alloy at different potentials in NaCl and Na2SO4 solutions10.1016/j.corsci.2022.110958 ↗
44. Effect of bias voltage on the electrochemical migration behaviors of Sn and Pb10.1109/TDMR.2009.2026737 ↗
45. Electrochemical migration of Sn and Sn solder alloys: a review10.1039/C7RA04368F ↗
46. Unveiling corrosion pathways of Sn nanocrystals through high-resolution liquid cell electron microscopy10.1021/acs.nanolett.3c03913 ↗
47. Electrochemical Behavior of 80% Sn-Cu Alloy in Some Carboxylic Acids and Buffer Solutions10.5006/0010-9312-32.1.30 ↗
48. Oxide/hydroxide films on tin. Part I: Kinetic aspects of the electroformation and electroreduction of the films10.1016/j.jelechem.2007.10.002 ↗
49. On the electrochemical migration mechanism of tin in electronics10.1016/j.corsci.2011.06.015 ↗
50. situ study of the electrochemical migration of tin in the presence of H₂S10.1007/s10854-020-03433-4 ↗
51. Corrosion behavior, whisker growth, and electrochemical migration of Sn–3.0 Ag–0.5 Cu solder doping with In and Zn in NaCl solution10.1016/j.microrel.2011.06.023 ↗
52. Formation of Ag dendrites: selective oxidation of Ag₃Sn and its electrochemical migration in halogen-containing media10.1016/j.corsci.2025.113087 ↗