Investigation of kinetics of ECM dendrite growth during corrosion in electronics
Source abstract
Abstract
Corrosion-related failures are critical for electronics reliability in various technological sectors, with a wide range of systems shifting towards the use of high voltage and power. Miniaturization and high voltage between closely spaced connectors induce a higher risk of dendrite formation due to electrochemical migration (ECM) when connected by a condensed water film. Shorting caused by ECM dendrites is a prominent failure mechanism in electronics, which at higher voltage could even lead to incidents of fire. Dendrite growth occurs by metal dissolution and electric field assisted deposition, while dendrite composition and shorting characteristics are determined by the kinetics of growth, controlled by the current. To study the kinetic factors related to dendrite growth, a galvanostatic approach with applied current in the range of 0.5 µA to 5 mA was employed on a simple test PCB consisting of two copper pads. Electrochemical testing was supplemented by chemical analysis of dissolved species in a micro-volume of solution using ICP-OES, while characteristics of dendrite as a function of current levels were analyzed using XPS, SEM-EDS and TEM. Dendrite growth and pH gradient increased with current levels. Dendrite composition varied depending on the current levels, while it was suggested that hydrolysis reactions rate determined local pH and dendrite morphology rather than the level of copper dissolution (Total charge Q T /Charge consumed by Cu dissolution Q Cu >1 for low and high current levels with shorting). A complementary potentiostatic test verified this understanding of charge consumed (Q T / Q Cu >1 at 2 V and 48 V applied voltage, without dendritic shorting). • Pure water conductivity increases as copper and OH - ion production increases. • Dendritic growth rate increases with increase in applied current level. • Passed charge drives copper dissolution, hydrolysis and dendrite current upon shorting. • Dendrite morphology changes with increasing current. • Q T /Q Cu rises with higher applied current suggesting more charge used for hydrolysis.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Electrical Contact Performance and Analysis · Copper Interconnects and Reliability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (48)
Show source-provided references
1. IPC, “IPC-2221A Generic Standard on Printed Board Design,” 2003. Accessed: Jun. 17, 2025. [Online]. Available: 〈https://www.ipc.org/TOC/IPC-2221A.pdf〉.
2. Printed circuit board surface finish and effects of chloride contamination, electric field, and humidity on corrosion reliability10.1007/s11664-016-4974-7 ↗
3. Corrosion reliability of electronic systems10.1149/1.2900650 ↗
4. Water film formation on the PCBA surface and failure occurrence in electronics
5. Parametric study of solder flux hygroscopicity: impact of weak organic acids on water layer formation and corrosion of electronics10.1007/s11664-018-6311-9 ↗
6. Humidity buildup in electronic enclosures exposed to constant conditions10.1109/TCPMT.2017.2655447 ↗
7. Transient risk of water layer formation on PCBAs in different climates: climate data analysis and experimental study10.1016/j.microrel.2022.114655 ↗
8. Investigation of critical factors effect to predict leakage current and time to failure due to ECM on PCB under humidity10.1016/j.microrel.2021.114418 ↗
9. Residue-assisted water layer build-up under transient climatic conditions and failure occurrences in electronics10.1109/TCPMT.2020.3005933 ↗
10. Analysis of surface insulation resistance related failures in electronics by circuit simulation10.1108/CW-09-2016-0040 ↗
11. Humidity-related failures in electronics: effect of binary mixtures of weak organic acid activators10.1007/s10854-018-9896-0 ↗
12. Solder flux residues and humidity-related failures in electronics: relative effects of weak organic acids used in no-clean flux systems10.1007/s11664-014-3609-0 ↗
13. Impact of NaCl contamination and climatic conditions on the reliability of printed circuit board assemblies10.1109/TDMR.2013.2293792 ↗
14. Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability10.1108/SSMT-05-2019-0020 ↗
15. Solder flux residues and humidity-related failures in electronics: relative effects of weak organic acids used in no-clean flux systems10.1007/s11664-014-3609-0 ↗
16. Mechanistic insight into water film formation and subsequent corrosion-linked dendritic growth on PCBs10.1016/j.corsci.2025.112741 ↗
17. Electrochemical migration and dendrite growth between two electrodes: experiments and Brownian dynamics simulations10.1016/j.ijheatmasstransfer.2024.126108 ↗
18. Effect of bias potential and dimension on electrochemical migration of capacitors for implantable devices
19. Effect of pulsed voltage on electrochemical migration of tin in electronics10.1007/s10854-015-3454-9 ↗
20. Power electronics reliability: state of the art and outlook10.1109/JESTPE.2020.3037161 ↗
21. Reliability of power converters in wind turbines: exploratory analysis of failure and operating data from a worldwide turbine fleet10.1109/TPEL.2018.2875005 ↗
22. Humidity and electronics
23. Electrochemical migration of Sn and Sn solder alloys: a review
24. On the electrochemical migration mechanism of tin in electronics10.1016/j.corsci.2011.06.015 ↗
25. Electrodeposition of copper: the nucleation mechanisms10.1016/S0013-4686(02)00161-5 ↗
26. Printed circuit board (PCB) technology for electrochemical sensors and sensing platforms
27. Kgoete · 2024
28. Electrochemical migration behavior of copper under a thin distilled water layer10.1016/j.corcom.2022.09.004 ↗
29. The effect of chloride ion concentration on electrochemical migration of copper10.1007/s10854-014-2640-5 ↗
30. Evaluation of electrochemical migration on flexible printed circuit boards with different surface finishes10.1007/s11664-009-0737-z ↗
31. Propensity of copper dendrite growth on subassembly package components used in quad flat package10.1109/TDMR.2008.919578 ↗
32. Electrochemical migration behavior between Cu and Ag under a thin electrolyte layer containing chloride10.1108/ACMM-11-2023-2924 ↗
33. Corrosion behavior of immersion silver printed circuit board copper under a thin electrolyte layer10.1016/j.engfailanal.2020.104807 ↗
34. Electrical conductivity of acidic sulfate solution
35. Electrochemical migration of tin in electronics and microstructure of the dendrites10.1016/j.corsci.2011.01.009 ↗
36. IPC, “IPC, Surface Insulation Resistance, IPC-TM-650,” Mar. 2007. [Online]. Available: 〈www.ipc.org/onlinestore〉.
37. Gen3, “Surface Insulation Resistance Testing System,” Hampshire. Accessed: Jun. 17, 2025. [Online]. Available: 〈www.gen3systems.com〉.
38. Thermo Scientific, “Thermo Scientific iCAP PRO Series ICP-OES, Technical Note TN73763-EN 0920S.”.
39. Influence of thermal annealing on microstructural, morphological, optical properties and surface electronic structure of copper oxide thin films10.1016/j.matchemphys.2014.06.047 ↗
40. National Institute of Standards and Technology, “NIST X-ray Photoelectron Spectroscopy Database (SRD 20), Version 5.0. Accessed: Jun 12, 2025. [Online]. Available:,” 〈https://srdata.nist.gov/xps/ElmComposition〉.
41. Review—Electrochemical migration in electronic materials: factors affecting the mechanism and recent strategies for inhibition10.1149/1945-7111/acb61a ↗
42. Electrochemical migration of tin in thin electrolyte layer containing chloride ions10.1016/j.corsci.2013.04.015 ↗
43. Empirical model for dissolved oxygen depletion during corrosion of drinking water copper pipes10.1016/j.corsci.2010.03.009 ↗
44. King · 2002
45. Copper corrosion at various pH values with and without the inhibitor10.1023/A:1003956102631 ↗
46. Binary copper oxide semiconductors: from materials towards devices10.1002/pssb.201248128 ↗
47. Properties, Synthesis, and Characterization of Cu-Based Nanomaterials
48. E. Bumiller and C. Hillman, “A Review of Models for Time-to-Failure Due to Metallic Migration Mechanisms,” College Park, Maryland. Accessed: Jul. 04, 2025. [Online]. Available: 〈https://smtnet.com/library/files/upload/Time-to-Failure_Metallic_Migration.pdf〉.