Mechanism modeling and prediction of Ag electrochemical migration failure in ultra-thin liquid film
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OpenAlex topics: Semiconductor materials and devices · Electrodeposition and Electroless Coatings · Copper Interconnects and Reliability
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References (52)
Show source-provided references
1. The technology status and trend for printed circuit board
2. Research on the corrosion and electrochemical migration failure of PCBA
3. Electrochemical processes resulting in migrated short failures in microcircuits10.1109/95.465159 ↗
4. Electrochemical migration of Sn and Sn solder alloys: a review10.1039/C7RA04368F ↗
5. Evaluation of electrochemical migration on printed circuit boards with lead-free and Tin-lead solder10.1007/s11664-011-1672-3 ↗
6. Corrosion of pure magnesium under thin electrolyte films Ι-influence of oxygen on corrosion of pure magnesium under thin electrolyte films
7. Influence of electrochemical properties on electrochemical migration of SnPb and SnBi solders10.1007/s12540-010-1007-6 ↗
8. K.Y. Wang, Research on PCB Corrosion Electrochemical Migration Behavior and Mechanism, Ph.D. thesis Civil Aviation University of China, Tianjin, 2023. https://doi.org/10.27627/d.cnki.gzmhy.2023.000270.
9. B.K. Liao, Study on The Corrosion, Electrochemical Migration and Its Inhibition Mechanism of Tin Based Lead-free Solder Alloys under Thin Electrolyte Layers, Ph.D. thesis, Huazhong University of Science and Technology, Wuhan, 2018..
10. In situ investigation of atmospheric corrosion behavior of PCB-ENIG under adsorbed thin electrolyte layer10.1016/S1003-6326(16)64213-9 ↗
11. Electrochemical migration behavior and mechanism of PCB-ImAg and PCB-HASL under adsorbed thin liquid films10.1016/S1003-6326(15)63861-4 ↗
12. Electrochemical migration behavior of copper under a thin distilled water layer10.1016/j.corcom.2022.09.004 ↗
13. Electrochemical migration of tin in thin electrolyte layer containing chloride ions10.1016/j.corsci.2013.04.015 ↗
14. Lifetime prediction of electrochemical ion migration with various surface finishes of printed circuit boards
15. Test methods for electrochemical migration: a review10.1007/s10854-016-5713-9 ↗
16. Electrochemical migration characteristics of eutectic Sn-Pb solder alloy in NaCl and Na2SO4 solutions10.1007/s11664-008-0636-8 ↗
17. Electrochemical migration behavior of cu, sn, ag and Sn63/Pb3710.1007/s10854-011-0435-5 ↗
18. Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates10.1007/s10854-013-1095-4 ↗
19. Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys10.1016/j.corsci.2015.07.026 ↗
20. X.K. Zhong, The Corrosion and Electrochemical Migration of Tin under Thin Electrolyte Layers, Ph.D. Huazhong University of Science and Technology Wuhan, 2014.
21. Electrochemical migration failure of pure tin under bromide-polluted thin electrolyte layer
22. The effect of electrolyte layer thickness on electrochemical migration of tin10.1016/j.corsci.2015.04.014 ↗
23. In situ optical inspection of electrochemical migration during THB tests10.1007/s10854-010-0198-4 ↗
24. Effect of surface finish material on printed circuit board for electrochemical migration10.1016/j.microrel.2007.09.006 ↗
25. Corrosion failure due to flux residues in an electronic add-on device10.1016/j.engfailanal.2010.02.010 ↗
26. Electrical properties and electrochemical migration characteristics of directly printed ag patterns with various sintering conditions10.1016/j.microrel.2013.10.002 ↗
27. Improvement of electrochemical migration resistance by Cu/Sn intermetallic compound barrier on cu in printed circuit board10.1109/TDMR.2012.2202906 ↗
28. Evaluation of electrochemical migration on flexible printed circuit boards with different surface finishes10.1007/s11664-009-0737-z ↗
29. The effect of chloride ion concentration on electrochemical migration of copper10.1007/s10854-014-2640-5 ↗
30. Analysis of the kinetics of electrochemical migration on printed circuit boards using Nernst-Plank transport equation10.1016/j.electacta.2014.06.041 ↗
31. Characteristics of environmental factor for electrochemical migration on printed circuit board10.1007/s10854-007-9421-3 ↗
32. On the electrochemical migration mechanism of tin in electronics10.1016/j.corsci.2011.06.015 ↗
33. A new understanding on the corrosion failure of Sn-based lead-free solder through the EIS monitoring and interpretation
34. Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components10.1179/1743278213Y.0000000078 ↗
35. Electrochemical migration of tin in electronics and microstructure of the dendrites10.1016/j.corsci.2011.01.009 ↗
36. Numerical simulation of electrochemical migration of cu based on the Nernst-Plank equation10.1016/j.ijheatmasstransfer.2021.122268 ↗
37. Nernst equation applied to electrochemical systems and centenary of his Nobel Prize in chemistry
38. The Butler-Volmer equation in electrochemical theory: origins, value, and practical application
39. Nernst-Planck equation and its application in ion exchange kinetics
40. Cao · 2008
41. Laurila · 2014
42. Fourth ed, butterworth heinemann, Oxford
43. Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water10.1007/s10854-006-6764-0 ↗
44. From ions in solution to ions in the gas phase - the mechanism of electrospray mass spectrometry
45. Effect of bias voltage on the electrochemical migration behaviors of sn and pb10.1109/TDMR.2009.2026737 ↗
46. Effect of initial anodic dissolution current on the electrochemical migration phenomenon of sn solder, j
47. Electrochemical migration on electronic chip resistors in chloride environments10.1109/TDMR.2009.2022631 ↗
48. In situ study the dependence of electrochemical migration of tin on chloride10.1016/j.elecom.2012.11.010 ↗
49. Na₂S-influenced electrochemical migration of tin in a thin electrolyte layer containing chloride ions10.1039/C6RA27823J ↗
50. FY. Electrochemical migration of nano-sized ag interconnects under deionized water and Cl--containing electrolyte10.1007/s10854-018-9947-6 ↗
51. Microstructure of Ni-based hard facing alloy and its polarization behavior in aqueous solution with different ph and chloride concentration10.1016/j.corcom.2021.11.001 ↗
52. Electrochemical migration behavior between cu and ag under a thin electrolyte layer containing chloride10.1108/ACMM-11-2023-2924 ↗