Fast etching of copper in thionyl chloride/acetonitrile solutions
Source abstract
Abstract
Abstract We report fast etching of copper (Cu) in thionyl chloride (SOCl2)/acetonitrile (CH3CN) solutions. The etching rate can be tuned over a wide range by varying the concentration of the etchant, and the stirring rate of the liquid. The etching rate reaches 36 mg min−1 cm−2 in 1 mol L−1 SOCl2/CH3CN under stirring at room temperature, which is much faster than any currently used etchant for Cu. With sonication, the etching rate reaches 320 mg min−1 cm−2. The chemical reactions involved are studied by X-ray photoelectron spectroscopy and Raman spectroscopy. The fast etching may find important applications in microelectronics.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Semiconductor materials and devices · Copper Interconnects and Reliability · Molecular Junctions and Nanostructures
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (12)
Show source-provided references
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