Numerical simulation of corrosion process with two-step charge transfer mechanism in the Cu/CuSO4+H2SO4 system

Abstract The corrosion process in the Cu/CuSO 4 + H 2 SO 4 system is considered as the sum of two coupled single-electron electrochemical reactions that occur simultaneously and independently on the surface of the copper electrode. Our numerical model incorporates diffusion and migration of solution species including cuprous ions, as well as the chemical equilibria for copper sulphate and sulphuric acid dissociation. Numerical simulations are compared with the trends discovered during experimental investigation of copper corrosion in similar systems.