Kinetics of the dissolution of copper in aqueous alkaline 2,2′-dipyridyl solutions

Abstract Kinetics of the dissolution of copper in aqueous alkaline 2,2′-dipyridyl solutions was investigated at varying oxygen partial pressure, complexing agent concentration, temperature and pH of the solution. It has been found that the oxygen partial pressure was the basic parameter which limited the process rate. The pH in the solution is the second factor that influences the dissolution rate at elevated oxygen partial pressure (0.05 MPa). It may be assigned to formation of various forms of Cu–2,2′-dipyridyl complex, depending on OH− ion concentration. Such complexes vary distinctly in their stability constant values.