Oxidation of liquid solders for die attachment
Source abstract
Abstract
Abstract This study deals with thermal oxidation behaviour in the liquid state of a commonly-used die-attach solder, Pb–Sn, and its potential Pb-free alternatives (Bi–Ag and Zn–Sn) from viewpoints of thermodynamics and kinetics. The characteristics of the oxidation reaction layers were investigated using XPS, XRD and AES. The superior performance in oxidation prevention of the Zn based alloys can be ascribed to their stable oxidative product, ZnO, which exhibits low free energy of formation, as well as slow growth rate.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Solidification and crystal growth phenomena · Intermetallics and Advanced Alloy Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (22)
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