Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals
Source abstract
Abstract
Abstract The oxidation resistance of two important surface finishes, electroless Ni/immersion Au (ENIG) and electroless Ni/electroless Pd/immersion Au (ENEPIG), is studied. Auger electron spectroscopy and X-ray photoelectron spectroscopy analyses show that ENEPIG is more oxidation resistant. The oxidized species of Ni diffuse through the Au grain boundaries. The mechanism for this better performance is that the Pd layer has an amorphous structure. The amorphous Pd layer is able to inhibit the out-diffusion of Ni atoms through high-diffusivity paths.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Semiconductor materials and devices · Copper Interconnects and Reliability · Semiconductor materials and interfaces
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (18)
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