On the relation between damage rate and stress level evolution in α-Cr2O3 thin films growing on Ni–33at%Cr

Abstract The blistering phenomenon has been studied in chromia films formed between 700 and 900 °C on Ni–33at%Cr. The experimental conditions of the blister occurrence and the damaged surface by blisters and spalls have been determined. From the comparison between the growth stress evolution in the oxide film – which has been related to the oxide microstructure development – and the damage rate the stress relaxation by creep is shown to prevent the formation of blisters and spalls.