The effect of different exposure conditions on the biofilm/copper interface

The effects of the different exposure conditions on the electrochemical behavior of copper were evaluated in a growth medium containing Shewanella oneidensis MR-1. Impedance spectra were recorded at the corrosion potential (Ecorr) in three different cells for one week of exposure followed by cyclic voltammetry. A second time constant was observed in the impedance spectra of copper that was partially immersed in the test cell, where the electrode was in contact with an air/liquid interface (cell B). These spectra resembled those usually observed for metals covered with a polymer coating. Complete immersion of copper in the electrolyte (no air/liquid interface) or deaeration of cell B resulted in one-time-constant spectra that are typical of those found for passive metals. Excellent corrosion protection was provided by MR-1 regardless of exposure condition. Ecorr increased with time for the partially immersed Cu electrode exposed to the aerated solution in cell B, while it decreased for the other two exposure conditions. Cathodic polarization curves recorded after exposure for 7 days showed two reduction peaks for copper tested in cell B, while no reduction peaks were observed for the other cases. Similar results were obtained using cyclic voltammetry.