A corrosion study of nanocrystalline copper thin films

Abstract Thin nanocrystalline, compact films, based on the copper–nitrogen system, up to 2.5 μm thickness and 3.5% nitrogen, were deposited by magnetron sputtering at different partial pressure ratios of N 2 and Ar, without formation of Cu x N compounds, the nitrogen concentration influencing grain size (down to 30 nm) and film homogeneity. Electrochemical corrosion properties were investigated using polarization curves and electrochemical impedance spectroscopy in 0.5 M NaCl aqueous solution, and compared with pure bulk copper; morphology was examined by scanning electron microscopy. Significant variations in corrosion currents between samples were attributed to grain size and structural defects on the grain boundaries.