“Special” to “general” transition of intergranular corrosion in Σ3{111} grain boundary with gradually changed misorientation
Source abstract
Abstract
Abstract The allowable angular deviation to show the “specialness” of coincident site lattice (CSL) grain boundaries has been demonstrated directly (not statistically as was done before) by Σ3{1 1 1} pure copper bicrystal with gradually changed misorientation fabricated by diffusion bonding. The dependence of sensitivity to intergranular corrosion on angular deviation has been examined by Livingston’s dislocation etchant which is sensitive to grain boundary structures. The critical angular deviation has been manifested, under which the grain boundary exhibited complete immunity to selective dissolution, and is smaller than the well-known Brandon criterion.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Microstructure and mechanical properties · Microstructure and Mechanical Properties of Steels · Hydrogen embrittlement and corrosion behaviors in metals
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (25)
Show source-provided references
1. Secondary recrystallization in copper
2. An approach to grain-boundary design for strong and ductile polycrystals
3. Weld decay-resistant austenitic stainless steel by grain boundary engineering10.1007/s10853-005-6511-6 ↗
4. Structure-dependence of intergranular corrosion in high purity nickel10.1016/0956-7151(90)90101-L ↗
5. The impact of grain-boundary-character-distribution on fracture in polycrystals10.1016/0921-5093(94)90957-1 ↗
6. Effect of boundary structure on slip-induced cavitation in polycrystalline nickel10.1016/0001-6160(84)90125-1 ↗
7. Structure of high-angle grain boundaries10.1016/0001-6160(66)90168-4 ↗
8. Burgers vectors of boundary dislocations in ordered grain boundaries of cubic metals10.1080/14786437308225821 ↗
9. Grain-boundaries: criteria of specialness and deviation from CSL misorientation10.1016/0001-6160(87)90217-3 ↗
10. On a more restrictive geometric criterion for special CSL grain boundaries10.1016/S1359-6462(98)00077-3 ↗
11. Grain-boundary structure effects on intergranular stress corrosion cracking of alloy X-75010.1016/S1359-6454(96)00125-5 ↗
12. Mechanical behaviour of Σ3 boundaries in Ni3Al10.1016/S1359-6454(03)00047-8 ↗
13. Application of EBSD to the analysis of interface planes: evolution over the last two decades10.1111/j.1365-2818.2008.02000.x ↗
14. Structures and energies of Σ3 asymmetric tilt grain boundaries in copper and aluminium10.1080/14786430701255895 ↗
15. The role of grain boundary plane orientation on intergranular corrosion of symmetric and asymmetric Σ3 tilt grain boundaries in directionally solidified pure copper10.1016/j.scriptamat.2004.03.016 ↗
16. Corrosion of some tilt and twist boundaries in aluminum bicrystals
17. Grain-boundary structure, energy and strength in molybdenum10.1016/0921-5093(94)90997-0 ↗
18. Intergranular corrosion of copper and a-Cu–Al alloy bicrystals10.1080/01418619108213908 ↗
19. Intergranular stress corrosion cracking of pure copper 〈111〉 tilt bicrystals10.1023/A:1015167030009 ↗
20. Behavior of intergranular corrosion of 〈011〉 tilt grain boundaries of pure copper bicrystals10.1016/S0010-938X(01)00158-5 ↗
21. Marin · 1999
22. Application of EBSD to the analysis of interface planes: evolution over the last two decades10.1111/j.1365-2818.2008.02000.x ↗
23. Etch pits at dislocations in copper10.1063/1.1735748 ↗
24. A kinetical model for the electrochemical grooving of grain boundaries10.1016/0013-4686(80)87127-1 ↗
25. The interaction between crystalline defects of electrodes and the kinetics of anodic dissolution. Application to grain boundary10.1016/S0022-0728(81)80128-3 ↗