The valence state of copper in anodic films formed on Al–1at.% Cu alloy

Abstract During anodising of Al–Cu alloys, copper species are incorporated into the anodic alumina film, where they migrate outward faster than Al3+ ions. In the present study of an Al–1at.% Cu alloy, the valence state of the incorporated copper species was investigated by X-ray photoelectron spectroscopy, revealing the presence of Cu2+ ions within the amorphous alumina film. However, extended X-ray irradiation led to reduction of units of CuO to Cu2O, probably due mainly to interactions with electrons from the X-ray window of the instrument and photoelectrons from the specimen. The XPS analysis employed films formed on thin sputtering-deposited alloy/electropolished aluminium specimens. Such an approach enables sufficient concentrations of copper species to be developed in the anodic film for their ready detection.