Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys
Source abstract
Abstract
The effect of current load was investigated on corrosion induced tin whisker growth from SnAgCu (SAC) solder alloys. Three alloys were studied: two low Ag content micro-alloyed SAC and the widely used SAC305. The solder joints were loaded with six different DC current levels between 0 and 1.5A and they were aged in corrosive environment (85 °C/85RH%) for 3000 h. The morphology of the whiskers and the micro-structural changes of the solder joints were examined by scanning electron microscope. It was shown that the current load can decrease the corrosion of the solder joints and consequentially it can decrease whiskering as well.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Electrical Contact Performance and Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (30)
Show source-provided references
1. Tin whisker growth from micro-alloyed SAC solders in corrosive climate10.1016/j.jallcom.2014.07.103 ↗
2. The effect of electrolyte layer thickness on electrochemical migration of tin10.1016/j.corsci.2015.04.014 ↗
3. Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics10.1016/j.corsci.2014.11.004 ↗
4. Reliability investigation of low silver content micro-alloyed SAC solders10.1109/ISSE.2012.6273126 ↗
5. Microalloying of alloys of the Sn–Ag–Cu system10.1007/s11041-010-9208-7 ↗
6. Drop shock reliability of lead-free alloys—effect of micro-additives
7. Understanding the effects of addition of copper nanoparticles to Sn-3. 5 Ag solder10.1108/09540911111120131 ↗
8. Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress10.1016/j.apsusc.2009.03.002 ↗
9. Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks10.1016/j.microrel.2009.02.026 ↗
10. Analysis of tin whisker growth on lead-free alloys with Ni presence under thermal shock stress10.1016/j.mseb.2010.10.001 ↗
11. Corrosion properties of tin–copper alloy coatings in aspect of tin whisker growth10.1016/j.jallcom.2013.06.092 ↗
12. Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy10.1016/j.jallcom.2009.02.118 ↗
13. Corrosion behavior, whisker growth, and electrochemical migration of Sn-3. 0Ag-0. 5Cu solder doping with In and Zn in NaCl solution10.1016/j.microrel.2011.06.023 ↗
14. Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing10.1016/j.jallcom.2014.05.200 ↗
15. Tin whiskers: attributes and mitigation
16. Electrostatic fields and current-flow impact on whisker growth10.1109/TEPM.2005.847814 ↗
17. Tin whisker growth driven by electrical currents10.1063/1.1712019 ↗
18. Tin whisker growth under cycling current pulse
19. Effect of current crowding on whisker growth at the anode in flip chip solder joints10.1063/1.2822446 ↗
20. Whisker growth in the crack region of the cathode interface during current stressing process in leadfree solder joints
21. The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth10.1016/j.microrel.2006.04.011 ↗
22. The effect of electric current and surface oxidization on the growth of Sn whiskers10.1016/j.apsusc.2010.05.045 ↗
23. Modelling the effect of uneven PWB surface on stencil bending during stencil printing process10.1016/j.microrel.2011.08.012 ↗
24. Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM10.1016/j.microrel.2011.12.035 ↗
25. Cramer · 2003 · Volume 13A
26. Influence of copper diffusion on the shape of whiskers grown on bright tin layers10.1016/j.microrel.2013.03.008 ↗
27. An arbitrary Lagrangian–Eulerian model for modelling the time-dependent evolution of crevice corrosion10.1016/j.corsci.2013.10.003 ↗
28. Efficiency of a conductive cement-based anodic system for the application of cathodic protection, cathodic prevention and electrochemical chloride extraction to control corrosion in reinforced concrete structures10.1016/j.corsci.2015.04.012 ↗
29. Corrosion and cathodic protection of carbon steel in the tidal zone: products, mechanisms and kinetics10.1016/j.corsci.2014.10.035 ↗
30. Effects of direct current electric field on corrosion behaviour of copper, Cl- ion migration behaviour and dendrites growth under thin electrolyte layer10.1016/S1003-6326(14)63059-4 ↗