Leaching of heavy metal elements in solder alloys
Source abstract
Abstract
Abstract Leaching behavior of heavy metal elements from Sn–3.5Ag–0.5Cu, Sn–9Zn, and Sn–37Pb solder alloys and their joints was investigated in typical H 2 SO 4 , NaCl and NaOH solutions. The leaching amount of Sn from solder joints was more than that from solder alloys and the leaching amount of Sn from Sn–3.5Ag–0.5Cu solder joint in the NaCl solution was the most. The surface corrosion products on the solder and their joints were composed of oxide, oxide hydroxide or oxychloride of the component element. Much more surface oxides for the samples treated in the NaCl solution produced than that in the NaOH and H 2 SO 4 solutions.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloy Microstructure Properties · Metallurgical Processes and Thermodynamics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (25)
Show source-provided references
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