The influences of traces of oxygen and sulfide on the corrosion of copper in concentrated chloride solutions
Source abstract
Abstract
The corrosion of wrought, electrodeposited, and cold spray deposited copper was electrochemically monitored for ~160 days in 3 M NaCl solution containing traces of sulfide under anoxic and Ar-purged conditions. Corroded specimens were analyzed using scanning electron microscopy and Raman and X-ray photoelectron/Auger spectroscopies. Under anoxic conditions, corrosion was supported by sulfide only and the rate decreased with time causing only minor damage. Under low oxygen conditions maintained by Ar-purging, the rate increased with time and significant damage was observed, attributed to oxy-sulfur species formation. These results suggest that oxy-sulfur species, not just sulfide, are required to cause intergranular corrosion.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Corrosion Behavior and Inhibition · High-Temperature Coating Behaviors · Hydrogen embrittlement and corrosion behaviors in metals
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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