Screening corrosion-resistant genetic elements of Sn-0.7Cu solders by high-throughput calculations
Source abstract
Abstract
The long-term challenge faced by Sn-0.7Cu eutectic solder is that the addition of alloying elements can lead to a decrease in corrosion performance. Herein, we report a new design scheme for screening Sn-0.7Cu type solders with corrosion resistant genetic elements from 30 alternative elements. The results indicate that economical Al, Zn and Ni are potential candidate genetic elements. After the adding genetic elements, the strain energy decreases. Corrosion cracks are difficult to open, extend, and propagate along the interface. The present findings may provide a feasible strategy for improving the corrosion resistance of multi-element Sn-based alloy solders.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Semiconductor materials and interfaces · Integrated Circuits and Semiconductor Failure Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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