Analysis of the influence and mechanism of the pollution condensation environment on the electrochemical migration behaviour of printed circuit board with immersion silver
Source abstract
Abstract
A refrigeration device was developed to induce condensation on printed circuit board with immersion silver (PCB-ImAg). Results show that in a condensation environment with low relative humidity, an electrolyte film can still be formed that allows conduction between the two poles of PCB-ImAg, allowing the thermodynamic conditions for electrochemical migration (ECM) to be reached and creating the risk of short-circuit failure. Under high relative humidity, the main body of ions that underwent ECM on the surface of PCB-ImAg was Cu 2+ and as the relative humidity of the environment increases, the short-circuit failure time shortens, and the initial current density increases.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Recycling and Waste Management Techniques · Corrosion Behavior and Inhibition · Additive Manufacturing and 3D Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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