journal article·2023-02

Study of effects of corrosion temperature on corrosion resistance of Cu-C alloys to liquid Ga

Dingjin He, Guangzhu Liu, Jingfu Liu, Hongyu Xie, Di Yue, Zelin Chen, Chong Wei, Xintong Xu, Haijiao Xie

Corrosion Science· Volume 211
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Abstract

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OpenAlex topics: Aluminum Alloys Composites Properties · Advanced materials and composites · Copper Interconnects and Reliability

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References (64)

Show source-provided references
1. S.H. Gunther, D.M. Carmean, Managing the impact of increasing microprocessor power consumption, First Quarter, Intel Technology Journal, California, 2001.
2. Memik · 2015
3. Shabany · 2009
4. Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink10.1016/S0017-9310(01)00337-4 ↗
5. Recent progress on liquid metals and their applications
6. A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid10.1007/s10010-006-0037-1 ↗
7. Cooling of high-power-density microdevices using liquid metal coolants10.1063/1.1772862 ↗
8. Nano liquid-metal fluid as ultimate coolant10.1016/j.physleta.2006.09.041 ↗
9. Heat-driven liquid metal cooling device for the thermal management of a computer chip10.1088/0022-3727/40/15/055 ↗
10. Self-driven electronic cooling based on thermosyphon effect of room temperature liquid metal10.1115/1.4005297 ↗
11. Convective cooling of compact electronic devices via liquid metals with low melting points
12. Numerical analysis of a liquid metal cooled mini channel heat sink with five different ceramic substrates10.1016/j.ceramint.2020.08.124 ↗
13. Energy efficient hotspot-targeted embedded liquid cooling of electronics10.1016/j.apenergy.2014.10.068 ↗
14. Design of practical liquid metal cooling device for heat dissipation of high performance CPUs10.1115/1.4002012 ↗
15. An integrated liquid cooling system based on galinstan liquid metal droplets10.1021/acsami.5b10769 ↗
16. Liquid metal composites with enhanced thermal conductivity and stability using molecular thermal linker10.1002/adma.202103104 ↗
17. Corrosion development between liquid gallium and four typical metal substrates used in chip cooling device10.1007/s00339-009-5098-1 ↗
18. Design of a self-driven liquid metal cooling device for heat dissipation of hot chips in a closed cabinet10.1115/1.4024786 ↗
19. EGaIn–metal interfacing for liquid metal circuitry and microelectronics integration10.1002/admi.201701596 ↗
20. Liquid metal embrittlement of aluminium by segregation of trace element gallium10.1016/j.corsci.2014.04.012 ↗
21. Interfacial reactions in the Cu/Ga/Co and Cu/Ga/Ni samples10.1007/s11664-019-07121-w ↗
22. Liquid metal corrosion effects on conventional metallic alloys exposed to eutectic gallium–indium alloy under various temperature states10.1007/s10765-018-2440-x ↗
23. Study on anti-corrosion technology and corrosion mechanism of Liquid GaIn alloy to copper
24. Chances and challenges of photovoltaic inverters with silicon carbide devices10.1016/j.rser.2017.04.096 ↗
25. Review on heat dissipation of high power electronic devices
26. Interface characteristics and corrosion behaviour of oriented bulk Fe2B alloy in liquid zinc10.1016/j.corsci.2013.08.033 ↗
27. Effect of orientation and lamellar spacing of Fe2B on interfaces and corrosion behavior of Fe-B alloy in hot-dip galvanization10.1016/j.actamat.2016.06.016 ↗
28. Multiphase interface structure induced erosion resistance of directional solidified Fe-B alloy in flow liquid zinc10.1016/j.matlet.2017.10.027 ↗
29. A novel electrical contact material with improved self-lubrication for railway current collectors10.1016/S0043-1648(01)00700-1 ↗
30. Wear mechanism in graphite–copper electrical sliding contact10.1016/S0043-1648(98)00412-8 ↗
31. (S) TEM study of different stages of Ti–45Al–8Nb–0.2W–0.2B–0.02Y alloy oxidation at 900℃10.1016/j.corsci.2007.11.013 ↗
32. Effect of crystal orientation on microstructure and properties of bulk Fe2B intermetallic10.1557/jmr.2014.383 ↗
33. Microstructure and interface characteristics of Fe–B alloy in liquid 0.25 wt% Al–Zn at various bath temperatures10.1016/j.matchemphys.2011.12.044 ↗
34. Interfacial morphologies and erosion–corrosion behavior of directional Fe-3.5 wt% B steel in flowing liquid Zn containing 0.30 wt% Al10.1016/j.corsci.2016.07.007 ↗
35. In Situ AFM and electrochemical study of a waterborne acrylic composite coating with CeO2 nanoparticles for corrosion protection of carbon steel10.1149/2.0071512jes ↗
36. Influence of grain boundaries on dissolution behavior of a biomedical CoCrMo alloy: in-situ electrochemical-optical, AFM and SEM/TEM studies10.1149/2.056209jes ↗
37. The mechanism of hydrogen-induced pitting corrosion in duplex stainless steel studied by SKPFM10.1016/j.corsci.2012.04.010 ↗
38. First-principle calculation of Volta potential of intermetallic particles in aluminum alloys and practical implications10.1149/2.0191709jes ↗
39. First-principles study on pitting corrosion of Al deoxidation stainless steel with rare earth element (La) treatment
40. J. Xu, X.B. Liu, Y.L. Jiang, F. Goodwin, High temperature electrochemical characterization of molten metal corrosion, U.S. Patent No. 8,173,007. 2012.
41. Efficient iterative schemes for ab initio total-energy calculations using a plane-wave basis set10.1103/PhysRevB.54.11169 ↗
42. Ab initio molecular dynamics for liquid metals10.1103/PhysRevB.47.558 ↗
43. Excess electron states in reduced bulk anatase TiO2: comparison of standard GGA, GGA+ U, and hybrid DFT calculations10.1063/1.2996362 ↗
44. Projector augmented-wave method10.1103/PhysRevB.50.17953 ↗
45. Generalized gradient approximation made simple10.1103/PhysRevLett.77.3865 ↗
46. Special points for Brillouin-zone integrations10.1103/PhysRevB.13.5188 ↗
47. Effect of matrix carbon species on interface wetting Behavior of C/Cu composites
48. Variations of work function and corrosion behaviors of deformed copper surfaces10.1016/j.apsusc.2004.07.017 ↗
49. Correlation between thermal parameters, structures, dendritic spacing and corrosion behavior of Zn-Al alloys with columnar to equiaxed transition10.1016/j.jcrysgro.2007.11.169 ↗
50. Semi-empirical modeling for columnar and equiaxed growth of alloys10.1016/S0022-0248(02)01136-3 ↗
51. Electrochemical and thermal behavior of copper coated type MAG-20 natural graphite10.1016/S0013-4686(01)00883-0 ↗
52. Comparative analysis of interdiffusion in some thin film metal couples at room temperature10.1016/0040-6090(92)90601-7 ↗
53. Properties of electric brushes made with Cu-coated graphite composites and with copper powders
54. M.S.T. Price, Copper-graphite materials in industrial carbon and graphite
55. Compatibility of ferrous alloys in a forced circulation Pb-17Li system10.1016/0022-3115(86)90055-3 ↗
56. Ga-Pb (gallium-lead)
57. G. Li, Y.L. Ji, M.K. Wu, H.B. Ma, Highly Conductive Thermal Paste of Liquid Metal Alloy Dispersed with Copper Particles, Proceedings of the ASME 2016 Heat Transfer Summer Conference, Vol. 50329. American Society of Mechanical Engineers, 2016. https://doi.org/10.1115/HT2016–7374.10.1115/HT2016-7374 ↗
58. Interface characterization and erosion–corrosion behavior of directional Fe-3.5wt% B steel in flowing liquid zinc at various temperatures10.1016/j.corsci.2015.12.018 ↗
59. Interfacial reactions in Cu/Ga and Cu/Ga/Cu couples10.1007/s11664-013-2721-x ↗
60. Transient liquid phase bonding10.1146/annurev.ms.22.080192.000323 ↗
61. Morphology and bond strength of copper wafer bonding10.1149/1.1626994 ↗
62. Overview of transient liquid phase and partial transient liquid phase bonding10.1007/s10853-011-5561-1 ↗
63. Insight into the interatomic competitive mechanism for interfacial stability of room temperature liquid GaInSn/Cu electrode10.1016/j.matchemphys.2021.124809 ↗
64. Insight into the effect of reorganized chemical short-range orders at Ga-based alloys/Cu interfaces on the nucleation and growth of CuGa2 crystals10.1016/j.matlet.2021.131029 ↗