journal article·2024-11

Influence of Pt addition on corrosion resistance of Sn-9Zn-0.02Al-xPt solder alloys

Zhihang Zhang, Yajia Liu, Tao Ma, Shiqiang Zhang, Xinquan Yang, Wei Shao, Jihua Huang, Shuhai Chen, Zheng Ye, Wanli Wang, Jian Yang

Corrosion Science· Volume 240
Publisher page

Abstract

The corrosion behaviour and mechanism of Sn-9Zn-0.02Al-xPt alloys were investigated. The addition of Pt significantly enhanced the corrosion resistance of the alloy, as evidenced by two key observations at different additive levels: (1) With a minor addition of Pt, the reduced potential difference between the small-sized Zn-rich phase and the eutectic phase decreased the galvanic corrosion sensitivity, and (2) with a large addition of Pt, the anodic barrier effect of the noble Pt 2Zn 10.72 phase and the consumption of Zn significantly protected the anodic Zn. The corrosion resistance increased in the order: Sn-9Zn-0.02Al-0.03Pt < Sn-9Zn-0.02Al < Sn-9Zn-0.02Al-0.01Pt, Sn-9Zn-0.02Al-0.1Pt < Sn-9Zn-0.02Al-0.25Pt.
Source: expertdata · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Intermetallics and Advanced Alloy Properties · Advanced materials and composites

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (57)

Show source-provided references
1. Magnetron sputtering preparation of Cu6Sn5 preferred-orientation coating and its influence on wettability of Sn-based lead-free solder10.1016/j.surfcoat.2022.129014 ↗
2. Corrosion behavior of Sn-3.0Ag-0.5Cu alloy under chlorine-containing thin electrolyte layers10.1016/j.corsci.2018.08.041 ↗
3. Metastable pitting and its correlation with electronic properties of passive films on Sn–xZn solder alloys10.1016/j.corsci.2015.06.036 ↗
4. Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn–Zn lead-free solder alloy by high-throughput method10.1007/s10854-022-09756-8 ↗
5. Electrochemical corrosion behaviour of Sn-Zn-xBi alloys used for miniature detonating cords10.1016/j.jmst.2019.03.026 ↗
6. In situ study on interfacial reactions of Cu/Sn–9Zn/Cu solder joints under temperature gradient10.1016/j.jallcom.2016.04.282 ↗
7. Role of graphene oxide (GO) for enhancing the solidification rate and mechanical properties of Sn–6.5Zn–0.4 wt% Cu Pb-free solder alloy10.1007/s10854-021-07324-0 ↗
8. Effect of Ni on the microstructure and properties of Sn-6.5Zn-3.0Bi solders10.1080/14786435.2022.2118384 ↗
9. Effects of Bi addition on the solderability and mechanical properties of Sn-Zn-Cu lead-Free solder10.1007/s11664-022-09732-2 ↗
10. The wettability andmicrostructure of Sn-Zn-RE alloys10.1007/s11664-003-0238-4 ↗
11. Effect of nano-Ag3Sn additions on wettability, interfacial intermetallic growth and mechanical properties of Zn–30Sn–1Ge solders on Cu substrates10.1007/s10854-020-03101-7 ↗
12. Microstructures formed from mixed solders on copper substrate10.1179/174328408X382226 ↗
13. Oxidation resistant effects of Ag2S in Sn–Ag–Al solder: a mechanism for higher electrical conductivity and less whisker growth10.1016/j.corsci.2015.12.021 ↗
14. Study on corrosion behavior of β-Sn and intermetallic compounds phases in SAC305 alloy by in-situ EC-AFM and first-principles calculation10.1016/j.corsci.2021.109244 ↗
15. Corrosion properties of Cu/Sn–3.0Ag–0.5Cu/Cu solder butt joints fabricated by conventional reflow and microwave hybrid heating10.1016/j.corsci.2022.110641 ↗
16. Electrochemical corrosion and electrochemical migration characteristics of SAC-1Bi-xMn solder alloys in NaCl solution10.1016/j.corsci.2023.110965 ↗
17. Composition and microstructure of Ag70Pd20Au10 alloy specimens with etching and their catalytic activity to decomposition of hydrogen peroxide10.1007/s10562-022-03972-x ↗
18. Effect of Au addition on the corrosion behavior of Al0.25CoCrFeNiCu0.25 high-entropy alloy in 0.5 M H2SO4 solution10.1016/j.matlet.2023.134932 ↗
19. Evaluation of the corrosion performance of Cu–Al intermetallic compounds and the effect of Pd addition10.1016/j.microrel.2015.10.012 ↗
20. Microstructure, wear resistance and corrosion resistance of CrN coating with platinum-iridium co-doping10.3390/coatings14020238 ↗
21. Hot corrosion behaviour of Pt modified aluminized NiCrAlYSi coating on a Ni-based single crystal superalloy10.1016/j.corsci.2019.01.014 ↗
22. Enhancing electrical conductivity and corrosion resistance of CrN coating by Pt addition10.3390/coatings11121479 ↗
23. Effect of Pt addition on the oxidation and corrosion resistance of Al0.25CoCrFeNi high-entropy alloy10.3390/met13101709 ↗
24. Influence of interfacial structure on bonding strength and thermoelectric transport properties of Cu6Sn5/Cu interface
25. Self-consistent equations including exchange and correlation effects10.1103/PhysRev.140.A1133 ↗
26. Influence behavior and mechanism of γ′- or γ′′-precipitated phase types on damage resistance of heterogeneous interface in nickel-based superalloys10.1016/j.jallcom.2022.166559 ↗
27. The convergence of a class of double-rank minimization algorithms 1.General considerations10.1093/imamat/6.1.76 ↗
28. Exploring the elastic and electronic properties of chromium molybdenum diboride alloys
29. First principle calculations and mechanical properties of the intermetallic compounds in a laser welded steel/aluminum joint10.1016/j.optlastec.2019.105875 ↗
30. Surface stability of WN ultrathin films under O2 and H2O exposure: A first-principles study
31. Influence of interfacial configuration on bonding properties and thermal conductivity of heterogeneous interface in Al/Graphite composite used for electronic packaging
32. First-principles calculations on wetting interface between Ag-Cu-Ti filler metal and SiC ceramic: Ag (111)/SiC (111) interface and Ag (111)/TiC (111) interface10.1016/j.apsusc.2018.08.074 ↗
33. Insights into the effect of γ′- or γ′′-precipitated phase types on resistance against harmful atoms of heterogeneous interface in nickel-based superalloys10.1016/j.jmrt.2023.08.182 ↗
34. Insight into the improvement of service performance of Sn/Cu solder joint by Pt doping in Cu6Sn5 interfacial intermetallic compound
35. Effect of Nd addition on the corrosion behavior of SAC305 solder alloy10.1016/j.corsci.2023.111264 ↗
36. On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material10.1016/j.matlet.2006.05.029 ↗
37. Properties and microstructure of Sn–0.7Cu–0.05Ni lead-free solders with rare earth Nd addition10.1007/s10854-018-0410-5 ↗
38. Molecular hume–rothery compounds [M(ZnR)n] and [M(ZnR)a(GaR)b] (a + 2b = n ≥ 8): relations of coordination polyhedra and electronic structure10.1021/ic200800e ↗
39. Potentiodynamic polarization measurement of Sn–8.5Zn–XAl–0.5Ga alloy in 3.5% NaCl solution10.1149/1.2209569 ↗
40. Electrochemical corrosion behaviour of Pb-free Sn–8.5Zn–0.05Al–XGa and Sn–3Ag–0.5Cu alloys in chloride containing aqueous solution10.1016/j.corsci.2008.06.042 ↗
41. EIS behavior of anodized zinc in chloride environments10.1016/S0010-938X(99)00129-8 ↗
42. Anodic passivation of tin in slightly alkaline solutions10.1016/0013-4686(80)80016-8 ↗
43. Effects of sample orientation on the corrosion of zinc in ammonium sulfate and sodium hydroxide solutions10.1016/0010-938X(91)90089-8 ↗
44. Effects of intermetallic-forming element additions on microstructure and corrosion behavior of Sn–Zn solder alloys10.1016/j.corsci.2016.07.004 ↗
45. Corrosion of Zircaloy-4, Zr-1Nb and FeCrAl alloys in deaerated water at 330 °C and 14 MPa: superior corrosion resistance and corrosion mechanism of FeCrAl alloy by experiments and molecular dynamics simulations10.1016/j.cej.2023.142143 ↗
46. Microstructural influence on corrosion behavior of MgZnGe alloy in NaCl solution10.1016/j.jallcom.2018.12.296 ↗
47. Preparation and characterization of neat and ZnCl2 modified zeolites and alumina for methyl chloride synthesis10.1016/j.apcata.2013.08.039 ↗
48. Effect of inhibition synergism of zinc chloride and 2-mercaptobenzoxzole on protective performance of an ecofriendly silane coating on mild steel10.1016/j.jiec.2016.12.024 ↗
49. XPS and optical studies of different morphologies of ZnO nanostructures prepared by microwave methods10.1016/j.ceramint.2012.08.075 ↗
50. Corrosion characterization of tin–lead and lead free solders in 3.5wt% NaCl solution10.1016/j.corsci.2007.11.025 ↗
51. Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution10.1016/j.jallcom.2017.04.281 ↗
52. Corrosion behaviour of AZ21, AZ501 and AZ91 in sodium chloride10.1016/S0010-938X(98)00078-X ↗
53. Electrochemical corrosion parameters of as-cast Al–Fe alloys in a NaCl solution10.1016/j.corsci.2010.05.011 ↗
54. Galvanic corrosion of metal/ceramic coupling10.1016/j.corsci.2013.11.024 ↗
55. γ1-Pt5Zn21—a reappraisal of a γ-brass type complex alloy phase10.1016/S1293-2558(03)00178-X ↗
56. The work function of the elements and its periodicity10.1063/1.323539 ↗
57. A computational study of the properties of low- and high-index Pd, Cu and Zn surfaces10.1039/D1CP01602D ↗