Modification copper surface by micron thickness film via thiol-based click reaction
Source abstract
Abstract
Films with micron thickness were fabricated on copper via thiol-based click reaction between dithiol and epoxy group or vinyl ester group on silane without metal catalyst or light irradiation. The protection efficiencies were 99.6% and 99.4% for the epoxy silane and vinyl ester-silane participated click-assembly film, respectively. The driving force for film formation was the strong interaction between thiol and copper and then new C-S bond formation via thiol-ene or thiol-epoxy reaction. Molecular dynamics simulation further revealed the most stable adsorption configurations and the adsorption energy of the building blocks on copper substrate to provide theoretical support for experimental conclusion.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Molecular Junctions and Nanostructures · Copper Interconnects and Reliability · Nanofabrication and Lithography Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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