Oxidation resistant effects of Ag2S in Sn–Ag–Al solder: A mechanism for higher electrical conductivity and less whisker growth
Source abstract
Abstract
Abstract Oxidation resistant effects of Ag2S in a ternary Sn–Ag–Al solder were investigated from the aspect of electrical conductivity. Combined reactions, associated with combustion and ionization of Ag2S, contributed to the removal of the oxide layers of the Ag2S-containing solder; as a result, lowering the overall O concentration. Because the diffusion of Ag2S suppressed oxidation in the Sn matrix, the electrical resistivity was significantly decreased. With regard to the improvement of the oxidation resistance and electrical conductivity, these oxidation resistant functions of Ag2S also inhibited the formation of intermetallic compounds (IMCs) and interrupted the growth of Sn whiskers.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Intermetallics and Advanced Alloy Properties · Electrical Contact Performance and Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (35)
Show source-provided references
1. Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics10.1016/j.corsci.2014.11.004 ↗
2. Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution10.1016/j.corsci.2014.05.004 ↗
3. In situ observations on creep fatigue fracture behavior of Sn–4Ag/Cu solder joints10.1016/j.actamat.2011.06.010 ↗
4. Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders10.1021/cm0709976 ↗
5. Development of Sn–Zn lead-free solders bearing alloying elements
6. Spectroscopic investigation of oxidized solder surfaces10.1016/j.corsci.2011.03.011 ↗
7. Magnetic nanoparticle-based solder composites for electronic packaging applications10.1016/j.pmatsci.2014.08.001 ↗
8. Oxidation of liquid solders for die attachment10.1016/j.corsci.2010.08.016 ↗
9. The oxidation of lead-free Sn alloys by electrochemical reduction analysis10.1007/s11837-005-0136-8 ↗
10. Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes10.1016/j.jallcom.2009.08.035 ↗
11. Surface oxidation of molten Sn (Ag, Ni, In, Cu) alloys
12. Solderability of Sn-9Zn–0.5 Ag-1In lead-free solder on Cu substrate: Part 1. Thermal properties, microstructure, corrosion and oxidation resistance10.1016/j.jallcom.2005.09.094 ↗
13. Retardation of spalling by the addition of Ag in Sn–Zn–Bi solder with the Au/Ni metallization10.1016/j.msea.2006.10.002 ↗
14. High-temperature oxidation of a Sn–Zn–Al solder10.1023/A:1018840405283 ↗
15. Reduced electrical resistivity of ternary solder alloy of tin–copper–sulfur: an anti-oxidative role of sulfur in binary solder alloy of Tin–Copper10.2320/matertrans.M2014102 ↗
16. Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder10.1016/j.jallcom.2009.10.190 ↗
17. Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder10.2320/matertrans.MBW200713 ↗
18. Phase transformation of the phosphorus-rich layer in SnAgCu/Ni–P solder joints10.1016/j.scriptamat.2006.01.006 ↗
19. Effect of Pd (P) thickness on the soldering reaction between Sn–3Ag–0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad10.1016/j.tsf.2014.12.026 ↗
20. Tin whisker growth from micro-alloyed SAC solders in corrosive climate10.1016/j.jallcom.2014.07.103 ↗
21. The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint10.1016/j.scriptamat.2009.02.061 ↗
22. Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints10.1016/j.scriptamat.2006.08.024 ↗
23. Sn whisker growth in Sn-9Zn-0.5Ga-0.7Pr lead-free solder10.1016/j.jallcom.2010.09.189 ↗
24. Spontaneous whisker growth on lead-free solder finishes10.1016/j.msea.2005.06.074 ↗
25. Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy10.1016/j.jallcom.2009.02.118 ↗
26. Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction10.1016/S1359-6454(03)00448-8 ↗
27. Effects of thermal cycling on rare earth (Pr)-induced Sn whisker/hillock growthcts of thermal cycling on rare earth (Pr)-induced Sn whisker/hillock growth10.1016/j.matlet.2013.01.065 ↗
28. Kinetics of Sn whisker nucleation using thermally induced stress10.1016/j.scriptamat.2014.08.019 ↗
29. Morphological study of silver corrosion in highly aggressive sulfur environments10.1016/j.engfailanal.2011.07.003 ↗
30. Laboratory scale investigation into the corrosion of copper in a sulphur-containing environment10.1016/j.corsci.2011.05.016 ↗
31. Sterling silver containing aluminium
32. Study on the microstructure, mechanical properties, tarnish and corrosion resistance of sterling silver alloyed with manganese10.1016/j.msea.2006.09.106 ↗
33. Reflectance and durability of Ag mirrors coated with thin layers of Al2O3 plus reactively deposited silicon oxide10.1364/AO.14.002639 ↗
34. Gas atomization of amorphous aluminum powder: Part II. Experimental investigation10.1007/s11663-009-9277-4 ↗
35. Photodeposition of Ag2S on TiO2 nanorod arrays for quantum dot-sensitized solar cells