Development of an in situ Hall-effect sensor for on-line monitoring of thickness and compaction during composite curing
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Abstract
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Research context
OpenAlex topics: Epoxy Resin Curing Processes · Injection Molding Process and Properties · Electronic Packaging and Soldering Technologies
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References (10)
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1. Development of a Hall effect sensor for in-situ monitoring of compaction during composite processing
2. 1989
3. Compaction behavior of thick composite laminates during cure
4. 1991
5. Monitoring consolidation of reinforcement plies in polymer matrix laminates
6. An expert system for autoclave curing of composites
7. Sprague Electronics Product Literature, Allegro Microsystems Inc., Suffolk Building, 53 Regional Dr., Concord, NH 03301, p.3.
8. McMaster-Carr Co., 600 County Line Rd., Elmhurst, IL 60126-2081, Tel. (708) 833-0300.
9. In-situ cure monitoring of advanced composite materials
10. Development of a novel Hall effect sensor to monitor thickness of a curing composite