Thermal properties of wood-derived copper–silicon carbide composites fabricated via electrodeposition
Source abstract
Abstract
Copper–silicon carbide composites were fabricated by electrodeposition of copper into pores of wood-derived silicon carbide, a ceramic with a microstructure that can be tailored via the use of different wood precursors. Thermal conductivity values were determined using flash diffusivity at temperatures from 0 to 900 °C. Thermal conductivities of up to 202 W/mK at 0 °C and 148W/mK at 900 °C were achieved. Object-oriented finite-element analysis (OOF) modeling was used to understand the heat flux distributions throughout the microstructures. OOF was also used to calculate the effective thermal conductivity, which correlated well with experimentally-determined values for axially-oriented composites. In addition, OOF was used to predict effective conductivity values and heat flux distributions for transversely-oriented composites.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Aluminum Alloys Composites Properties · Advanced ceramic materials synthesis · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (25)
Show source-provided references
1. Metal–matrix composites for electronic packaging
2. Zweben C. Ultrahigh-thermal-conductivity packaging materials. In: IEEE/CPMT semiconductor thermal measurement and management symposium (SEMI-THERM); 2005. p. 168–74.10.1109/STHERM.2005.1412174 ↗
3. Advances in LED packaging and thermal management materials
4. The role of compound formation in reactive wetting: the Cu/SiC system10.1016/S1359-6454(00)00235-4 ↗
5. Silicon carbide whisker copper–matrix composites fabricated by hot pressing copper coated whiskers10.1007/BF01139157 ↗
6. Fabrication of CuSiC metal matrix composites10.1007/s10853-005-2622-3 ↗
7. The microstructure and the thermal expansion characteristics of Cu/SiCp composites10.1016/S0921-5093(02)00788-8 ↗
8. Biomimetic process for producing SiC wood10.1111/j.1151-2916.1995.tb07988.x ↗
9. Biomorphic cellular silicon carbide ceramics from wood: I. Processing and microstructure10.1016/S0955-2219(98)00156-3 ↗
10. Biomorphic cellular silicon carbide ceramics from wood: II. Mechanical properties10.1016/S0955-2219(98)00155-1 ↗
11. Biomorphic SiC: a new engineering ceramic material10.1111/j.1744-7402.2004.tb00155.x ↗
12. Processing of wood-derived copper–silicon carbide composites via electrodeposition10.1016/j.compscitech.2009.12.019 ↗
13. Pappacena KE. Thermal properties of wood-derived silicon carbide and copper–silicon carbide composites. PhD Thesis, Northwestern University; 2008.
14. Miller · 1990
15. Precursor selection and its role in the mechanical properties of porous SiC derived from wood10.1016/j.msea.2006.05.033 ↗
16. Radiation loss in the flash method for thermal diffusivity10.1063/1.321635 ↗
17. OOF: an image-based finite-element analysis of material microstructures10.1109/5992.919261 ↗
18. Langer SA, Carter WC, Fuller Jr ER, Roosen A. OOF. National Institute of Standards and Technology, Gaithersburg (MD); 1997.
19. Low-thermal-conductivity plasma-sprayed thermal barrier coatings with engineered microstructures10.1016/j.actamat.2006.03.024 ↗
20. Thermal conductivity of porous silicon carbide derived from wood precursors10.1111/j.1551-2916.2007.01777.x ↗
21. Chawla · 1998
22. Thermal conductivities of composite materials10.1177/002199836800200101 ↗
23. Touloukian YS, Liley PE, Saxena SC. Thermophysical properties of matter. Thermal conductivity: nonmetallic liquids and gases, vol. 3. New York: IFI/Plenum; 1977.
24. Touloukian YS, Powell RW, Ho CY, Klemens PG. Thermophysical properties of matter. Thermal conductivity: metallic elements and alloys, vol. 1. New York: IFI/Plenum; 1977.
25. Quantitative studies of thermal shock in ceramics based on a novel test technique10.1111/j.1151-2916.1981.tb09606.x ↗