Thermal conductivity and thermal contact conductance studies on Al2O3/Al–AlN metal matrix composite
Source abstract
Abstract
Al2O3/Al–AlN is a metal matrix composite (MMC) used for making heat sink of electronic devices. This paper presents the detailed investigations carried out on thermal contact resistance across this MMC contact in vacuum at different contact pressures. The experimental results are compared with the theoretical models available in the literature for metallic contacts and they are found to be in good agreement with each other.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Adhesion, Friction, and Surface Interactions · Electronic Packaging and Soldering Technologies · Electrical Contact Performance and Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (8)
Show source-provided references
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