journal article·2020-11

Epoxy-based thermally conductive adhesives with effective alumina and boron nitride for superconducting magnet

Young Jin Hwang, Jun Min Kim, Lee Su Kim, Jae Young Jang, Myungsu Kim, Sooyeol Jeong, Jung Young Cho, Gi-Ra Yi, Yeon Suk Choi, Gaehang Lee

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Abstract

Abstract Heat management is one of the key technologies for reliable and high-performance electric devices. We have developed thermally conductive adhesives based on a commercial thermally conductive epoxy, Stycast 2850FT (S2850), with an additional unfilled resin and boron nitride (BN). The optimal mixing ratio of BN to epoxy resin was 10 wt%, and the thermal conductivity (κ) of this mixture was 1.65 W/m·K at 25 °C, 1.6 times higher than that of S2850. Such enhancement of κ may be attributed to the formation of more thermal conductive paths generated by the effective additives inside the composite adhesive layers, which was confirmed with elemental mapping analysis. Our epoxy-based thermally conductive adhesives with improved κ was then implemented for a superconducting magnet. Because of the enhanced heat dissipation of our composite adhesive, the superconducting magnet showed enhancement of 42.7%, 14.8%, and 76.6% in the cooling rate, the minimum quench energy, and the normal zone propagation velocity in the longitudinal direction at 70% of the current-carrying capacity, respectively, which are important parameters in the operational performance of a superconducting magnet, compared to a coil with S2850.
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Research context

OpenAlex topics: Thermal properties of materials · Heat Transfer and Optimization · Graphene research and applications

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