Well-organized organosilane composites for adhesion enhancement of heterojunctions
Source abstract
Abstract
Abstract Flexible copper clad laminate (FCCL) is the key base material for versatile applications such as mobile devices, wearable electronics, and point-of-care biosensors. Development of adhesiveless FCCL is urgent to achieve a thinner, lighter, and thermally stable substrate for advanced high-frequency (5G) applications. In this study, a co-silanization method is proposed to functionalize the polyimide (PI) surface for efficient metal immobilization and adhesion enhancement. The co-silanization treatment features the establishment of a barricade-like network structure by the assistant organosilane, trimethoxyphenylsilane (TMPS), to generate spatial confinement effect (SCE) to effectively control the positioning and grafting orientation of the functional organosilane, 3-[2-(2-aminoethylamino)ethylamino]propyl-trimethoxysilane (ETAS), on the PI film. Benefitting from the effective positioning and grafting, the two types of organosilanes form a composite well-organized molecular nanolayer which is in possession of strong tethering ability for metal attachment and immobilization. Compared to the mono-silanization system with ETAS only (0.652 kgf/cm), the co-silanization treatment (ETAS + TMPS) remarkably enhances the peel strength of the deposited metal layer on PI by 53% (~1 kgf/cm).
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Synthesis and properties of polymers · Advanced Sensor and Energy Harvesting Materials · Silicone and Siloxane Chemistry
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (57)
Show source-provided references
1. Wearable electronics and smart textiles: a critical review10.3390/s140711957 ↗
2. Study of surface metallization of polyimide film and interfacial characterization10.3390/met7060189 ↗
3. Macleod · 2002
4. Challenges of wire bonding with polyimide flexible printed circuit board (FPCB)
5. Effect of Ni-Cr layer on adhesion strength of flexible copper clad laminate10.1007/s11664-008-0543-z ↗
6. Flexible‐device injector with a microflap array for subcutaneously implanting flexible medical electronics10.1002/adhm.201800419 ↗
7. Subdermal flexible solar cell arrays for powering medical electronic implants10.1002/adhm.201600222 ↗
8. Multi-layered plasma-polymerized chips for SPR-based detection10.1021/am201061k ↗
9. PECVD coatings for functionalization of point-of-care biosensor surfaces10.1016/j.vacuum.2011.08.014 ↗
10. Self-referencing fiber optic particle plasmon resonance sensing system for real-time biological monitoring10.1016/j.talanta.2015.08.047 ↗
11. Stretchable and self-healing polymers and devices for electronic skin10.1016/j.progpolymsci.2013.08.001 ↗
12. Electronic skin: recent progress and future prospects for skin-attachable devices for health monitoring, robotics, and prosthetics10.1002/adma.201904765 ↗
13. Advanced polyimide materials: syntheses, physical properties and applications10.1016/j.progpolymsci.2012.02.005 ↗
14. Modification of Cu nanoparticles with a disulfide for polyimide metallization10.1039/b920626d ↗
15. Adhesion and interfacial characteristics of metal/PI composite film modified by O2 ion beam10.1016/j.tsf.2008.06.022 ↗
16. Chemical formation of palladium-free surface-nickelized polyimide film for flexible electronics10.1016/j.tsf.2007.12.166 ↗
17. Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer10.1016/j.ijadhadh.2009.07.001 ↗
18. Thermal- and solution-processable polyimides based on mellophanic dianhydride and their applications as heat-resistant adhesives for copper-clad laminates10.1016/j.reactfunctpolym.2010.11.021 ↗
19. Design of long-chain branched copolyesters and manufacture as well As physical properties of their extrusion films10.1016/j.reactfunctpolym.2017.11.007 ↗
20. Application of magnetic pulse welding technique for flexible printed circuit boards (FPCB) lap joints10.1016/j.jmatprotec.2012.12.004 ↗
21. Effect of N2 plasma treatment on the adhesion of Cu/Ni thin film to polyimide10.1007/s12540-011-1015-1 ↗
22. Surface modification of polyimide film by coupling reaction for copper metallization10.1016/j.jiec.2008.08.016 ↗
23. Improved polyimide/metal adhesion by chemical modification approaches10.1002/app.2043 ↗
24. Fabrication and adhesion strength of Cu/Ni–Cr/polyimide films for flexible printed circuits10.1016/j.mee.2011.01.071 ↗
25. Surface modification of polyimide film surface by silane coupling reactions for copper metallization10.1163/15685610152540821 ↗
26. Improved adhesion between Kapton film and copper metal by silane-coupling reactions10.1002/(SICI)1097-4628(19990829)73:9<1645::AID-APP5>3.0.CO;2-L ↗
27. Efficient and adhesiveless metallization of flexible polyimide by functional grafting of carboxylic acid groups10.1021/acs.langmuir.9b00354 ↗
28. Copper/polyimide heterojunctions: controlling interfacial structures through an additive‐based, all‐wet chemical process using ion‐doped precursors10.1002/adfm.200600527 ↗
29. Effect of Cr thickness on adhesion strength of Cu/Cr/polyimide flexible copper clad laminate fabricated by roll-to-roll process10.2320/matertrans.M2009276 ↗
30. Adhesion improvement of polyimide/metal interface by He/O2/NF3 atmospheric pressure plasma10.1002/ppap.200931111 ↗
31. Peel strength of sputtered FCCL(flexible copper clad laminate) using Ar:O2 mixed gas preprocessing and a Ni-Cr seed layer10.1007/s13391-013-3316-7 ↗
32. Improved adhesion of Ag NPs to the polyethylene terephthalate surface via atmospheric plasma treatment and surface functionalization10.1016/j.apsusc.2017.03.149 ↗
33. A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics10.1016/j.electacta.2016.08.143 ↗
34. Electroless deposition metals on poly(dimethylsiloxane) with strong adhesion as flexible and stretchable conductive materials10.1021/acsami.7b15726 ↗
35. Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition10.1016/j.apsusc.2009.12.153 ↗
36. Adhesion of polyimides to metal and ceramic surfaces: an overview10.1163/156856190X00612 ↗
37. Corrosion protection and adhesion promotion for polyimide/copper system using silane-modified polymeric materials10.1016/S0032-3861(00)00007-0 ↗
38. A wet process for forming an adhesive copper layer on polyimide film10.5796/electrochemistry.76.191 ↗
39. Electroless deposition of copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization and silanization10.1021/la9914211 ↗
40. Kinetics of hydrolysis and self condensation reactions of silanes by NMR spectroscopy10.1016/j.colsurfa.2007.06.028 ↗
41. Energy/electron transfer switch for controlling optical properties of silicon quantum dots10.1038/s41598-018-35201-0 ↗
42. XPS and AFM characterization of aminosilanes with different numbers of bonding sites on a silicon wafer10.1002/sia.5311 ↗
43. Adsorption behaviors of deposition-targeted metallic ions onto thiol-containing silane modified liquid crystal polymer surfaces10.1016/j.apsusc.2019.01.262 ↗
44. Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes10.1016/j.electacta.2015.01.161 ↗
45. Structure and morphology of self-assembled 3-mercaptopropyltrimethoxysilane layers on silicon oxide10.1016/S0169-4332(01)00399-3 ↗
46. Silane deposition via gas-phase evaporation and high-resolution surface characterization of the ultrathin siloxane coatings10.1021/acs.langmuir.8b01044 ↗
47. Silatranes: a review on their synthesis, structure, reactivity and applications10.1039/B925899J ↗
48. Silanization of solid surfaces via mercaptopropylsilatrane: a new approach of constructing gold colloid monolayers10.1039/C4RA05583G ↗
49. Facile functionalization of polymer surfaces in aqueous and polar organic solvents via 3-mercaptopropylsilatrane10.1021/acsami.6b13926 ↗
50. Mikić · 2012 · 161
51. Ćupina · 2011 · 347
52. Mutual intercropping-inspired co-silanization to graft well-oriented organosilane as adhesion promotion nanolayer for flexible conductors10.1016/j.jiec.2019.11.017 ↗
53. Chemical modification of silica surface by immobilization of functional groups for extractive concentration of metal ions10.1016/j.talanta.2003.10.028 ↗
54. Removal of copper ions using functionalized mesoporous silica in aqueous solution10.1081/SS-100106101 ↗
55. Improvement of adsorbent materials for CO2 capture by amine functionalized mesoporous silica with worm-hole framework structure10.1016/j.cej.2016.07.041 ↗
56. The combination of π-π interaction and covalent bonding can synergistically strengthen the flexible electrical insulating nanocomposites with well adhesive properties and thermal conductivity10.1016/j.compscitech.2017.09.018 ↗
57. Flexural and fracture mechanical properties of in situ particulate reinforced organomineral hybrid resins modified by organofunctional silanes10.1016/j.compscitech.2019.02.013 ↗