Thermal expansion of a novel hybrid SiC foam–SiC particles–Al composites

Abstract A new type of hybrid SiC foam–SiC particles–Al composites (VSiC = 53, 56.2 and 59.9%) to be used as an electronic packaging substrate material were fabricated by squeeze casting technique, and their thermal expansion behavior was evaluated. The coefficients of thermal expansion (CTEs) of the hybrid composites in the range of 20–100 °C were found to be between 6.6 and 7.7 ppm/°C. The measured CTEs are much lower than those of SiC particle-reinforced aluminum (SiCp–Al) composites with the same content of SiC because of the characteristic interpenetrating structure of the hybrid composites. A material of such a low CTE is ideal for electronic packaging because of the low thermal mismatch (and therefore, low thermal stresses) between the electronic component and the substrate. To achieve similar CTEs in SiCp–Al composites, the volume fraction of SiC would be much higher than that in the hybrid composites.