Mode I fracture toughness of an adhesively bonded composite–composite joint in a cryogenic environment
Source abstract
Abstract
Abstract To determine the effect of cryogenic temperature on the adhesive fracture toughness of an adhesively bonded joint with composite adherends, monotonic mode I adhesive fracture toughness tests were performed at liquid nitrogen temperature (−196 °C) and at room temperature (27 °C). From these experimental tests, the critical strain energy release rate for both test temperatures was evaluated for the selected bonded joint system constructed of carbon-BMI adherends bonded with AF-191M film adhesive. Experimental results exhibit reduced adhesive fracture toughness at the cryogenic temperature and a profound difference in fracture mode.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Mechanical Behavior of Composites · Electronic Packaging and Soldering Technologies · Mechanical stress and fatigue analysis
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References (13)
Show source-provided references
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