Effect analysis of filler sizes on percolation threshold of isotropical conductive adhesives
Source abstract
Abstract
Abstract By varying the concentration of surfactant in reverse micelle system, Ag particles from 10 to 200 nm in average diameter were synthesized, which have been characterized by X-ray diffraction and transmission electron microscopy. Isotropical conductive adhesives (ICAs) were prepared by using Ag particles as conductive fillers. It was found that the percolation threshold of ICAs depends on the filler size, which reaches to 63 wt.% when the filler average particle diameter is 50 nm. Results obtained by theoretical calculation are in good agreement with the experimental results.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Surface Roughness and Optical Measurements · Nanomaterials and Printing Technologies · Electrowetting and Microfluidic Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (15)
Show source-provided references
1. Wu · 2000
2. Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles10.1016/S1369-8001(99)00018-9 ↗
3. Conductivity of conductive polymer for flip chip bonding and BGA socket10.1016/S0026-2692(00)00153-1 ↗
4. Wong CP, Lu D. Development of solder replacement isotropic conductive adhesives. Electronics Packaging Technology Conference, 2000. p. 214–21.10.1109/EPTC.2000.906376 ↗
5. Development of high conductivity lead (Pb)-free conducting adhesives
6. Isotropic conductive adhesives filled with low-melting-point alloy fillers10.1109/6104.873246 ↗
7. Study of isotropically conductive bondings filled with aggregates of nano-sized Ag-particles
8. Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives10.1109/6104.816098 ↗
9. Fan L, Su B, Qu J, Wang CP. Effects of nano-sized particles on electrical and thermal conductivities of polymer composites. In: Ninth international symposium on advanced packaging materials, 2004. p. 193–9.
10. Electrical conduction models for isotropically conductive adhesive joints
11. Synthesis of nanosize silica in a nonionic water-in-oil microemulsion: effects of the water/surfactant molar ratio and ammonia concentration10.1006/jcis.1998.5985 ↗
12. Synthesis and structural characterisation of CdS nanoparticles prepared in a four-components “water-in-oil” microemulsion10.1016/S0968-4328(99)00091-8 ↗
13. Formation of ordered arrays of gold nanoparticles from CTAB reverse micelles10.1016/S0167-577X(00)00385-2 ↗
14. Onset of electrical conduction in isotropic conductive adhesives: a general theory10.1016/S1369-8001(99)00035-9 ↗
15. Su B, Qu J. A micromechanics model for electrical conduction in isotropically conductive adhesives during curing, electronic components and technology conference, 2004. p. 1766–71.