journal article·2015Open access

Effect of amounts and types of silicon nitride on thermal conductivity of Si3N4/epoxy resin composite

Akihiro SHIMAMURA, Yuji HOTTA, Hideki HYUGA, Naoki KONDO, Kiyoshi HIRAO

Journal of the Ceramic Society of Japan· Volume 123· Issue 1441

Abstract

Thermal conductive ceramic/resin composites are necessary for thermal management in order to improve the reliability of high-performance products in various industrial fields. The present study created composites consisting of silicon nitride (Si3N4) particles and epoxy resin by imbedding the particles into the resin matrix. Two common types of Si3N4 were applied in this work. α phase (α-Si3N4) and β phase (β-Si3N4) silicon nitride were loaded with epoxy resin. The effect of Si3N4 type on the thermal conductivity of composites was investigated by varying the Si3N4 particle content. For composites below 50 vol.% Si3N4, there was almost no difference in thermal conductivity between equivalently loaded α-Si3N4 or β-Si3N4/epoxy composites. However, for Si3N4 contents exceeding 50 vol.%, the β-Si3N4/epoxy composites showed higher thermal conductivities relative to the α-Si3N4/epoxy composite. The relative difference in thermal conductivities between the β-Si3N4 and α-Si3N4 epoxy composites (β-Si3N4/α-Si3N4) increased to 1.6 times at 68 vol.% of Si3N4 content.
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Research context

OpenAlex topics: Thermal properties of materials · Advanced ceramic materials synthesis · High voltage insulation and dielectric phenomena

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

National Institute of Advanced Industrial Science and Technology (AIST)

References (27)

Show source-provided references
1. 1) H. He, R. Fu, Y. Han, Y. Shen and X. Song, J. Mater. Sci., 42, 6749–6754 (2007).10.1007/s10853-006-1480-y ↗
2. 2) J. Gu, Q. Zhang, J. Dang and C. Xie, Polym. Adv. Technol., 23, 1025–1028 (2012).10.1002/pat.2063 ↗
3. 3) E. Amendola, A. M. Scamardella, C. Petrarca and D. Acierno, J. Appl. Polym. Sci., 122, 3686–3693 (2011).10.1002/app.34782 ↗
4. 4) Y. M. Chen and J. M. Ting, Carbon, 40, 359–362 (2002).10.1016/S0008-6223(01)00112-9 ↗
5. 5) M. J. Biercuk, M. C. Llaguno, M. Radosavljevic, J. K. Hyun, A. T. Johnson and J. E. Fischer, Appl. Phys. Lett., 80, 2767–2769 (2002).10.1063/1.1469696 ↗
6. 6) T. Zhou, X. Wang, M. Gu and D. Xiong, Polym. J., 41, 51–57 (2009).10.1295/polymj.PJ2008173 ↗
7. 7) Y. Xu and D. D. L. Chung, Compos. Interfaces, 7, 243–256 (2000).10.1163/156855400750244969 ↗
8. 8) K. C. Yung and H. Liem, J. Appl. Polym. Sci., 106, 3587–3591 (2007).10.1002/app.27027 ↗
9. 9) Y. Nagai and G. C. Lai, J. Ceram. Soc. Japan, 105, 197–200 (1997).10.2109/jcersj.105.197 ↗
10. 10) E. S. Lee, S. M. Lee, D. J. Shanefield and W. R. Cannon, J. Am. Ceram. Soc., 91, 1169–1174 (2008).10.1111/j.1551-2916.2008.02247.x ↗
11. 11) T. Kusunose, T. Yagi, S. H. Firoz and T. Sekino, J. Mater. Chem. A, 1, 3440–3445 (2013).10.1039/c3ta00686g ↗
12. 12) T. L. Li and S. L. C. Hsu, J. Phys. Chem. B, 114, 6825–6829 (2010).10.1021/jp101857w ↗
13. 13) K. Sato, H. Horibe, T. Shirai, Y. Hotta, H. Nakano, H. Nagai, K. Mitsuishi and K. Watari, J. Mater. Chem., 20, 2749–2752 (2010).10.1039/b924997d ↗
14. 14) K. Hirao, Y. Zhou, H. Hyuga, T. Ohji and D. Kusano, J. Korean Ceram. Soc., 49, 380–384 (2012).10.4191/kcers.2012.49.4.380 ↗
15. 15) N. Hirosaki, S. Ogata, C. Kocer, H. Kitagawa and Y. Nakamura, Phys. Rev. B, 65, 1341101 (2002).10.1103/PhysRevB.65.134110 ↗
16. 16) Y. Zhou, H. Hyuga, D. Kusano, Y.-i. Yoshizawa and K. Hirao, Adv. Mater., 23, 4563–4567 (2011).10.1002/adma.201102462 ↗
17. 17) H. He, R. Fu, Y. Shen, Y. Han and X. Song, Compos. Sci. Technol., 67, 2493–2499 (2007).10.1016/j.compscitech.2006.12.014 ↗
18. 18) M. Kitayama, K. Hirao, A. Tsuge, M. Toriyama and S. Kanzaki, J. Am. Ceram. Soc., 82, 3263–3265 (1999).10.1111/j.1151-2916.1999.tb02238.x ↗
19. 19) R. C. Progelhof, J. L. Throne and R. R. Ruetsch, Polym. Eng. Sci., 16, 615–625 (1976).10.1002/pen.760160905 ↗
20. 20) C. P. Wong and R. S. Bollampally, J. Appl. Polym. Sci., 74, 3396–3403 (1999).10.1002/(SICI)1097-4628(19991227)74:14<3396::AID-APP13>3.0.CO;2-3 ↗
21. 21) D. A. G. Bruggeman, Annalen der Physik, 416, 636–664 (1935).10.1002/andp.19354160705 ↗
22. 22) P. Bujard, G. Kuhnlein, S. Ino and T. Shiobara, IEEE Trans. Compon. Packag. Manuf. Tech., 17, 527–532 (1994).10.1109/95.335037 ↗
23. 23) I. A. Tsekmes, R. Kochetov, P. H. F. Morshuis, and J. J. Smit, ICSD 2013 — Proceedings of the 2013 IEEE International Conference on Solid Dielectrics, Jun. 30–Jul. 04, Bologna, Italy, (2013) pp. 678–681.
24. 24) S. S. Vaisakh, M. Hassanzadeh, R. Metz, S. Ramakrishnan, D. Chappelle, J. D. Sudha and S. Ananthakumar, Polym. Adv. Technol., 25, 240–248 (2014).10.1002/pat.3230 ↗
25. 25) C. Y. Hsieh and S. L. Chung, J. Appl. Polym. Sci., 102, 4734–4740 (2006).10.1002/app.25000 ↗
26. 26) A. Bunde and W. Dieterich, J. Electroceram., 5, 81–92 (2000).10.1023/A:1009997800513 ↗
27. 27) M. Kitayama, K. Hirao, A. Tsuge, K. Watari, M. Toriyama and S. Kanzaki, J. Am. Ceram. Soc., 83, 1985–1992 (2000).10.1111/j.1151-2916.2000.tb01501.x ↗