journal article·2016-01

Experimentation and simulation of moisture diffusion in foam-cored polyurethane sandwich structure

Z Huo, M Mohamed, J R Nicholas, X Wang, K Chandrashekhara

Publisher page

Abstract

The moisture diffusion behavior of two-part thermoset polyurethane neat resin, woven E-glass fiber-reinforced polyurethane face sheet, closed-cell rigid polyurethane foam core and their corresponding sandwich specimens was investigated in this study. The vacuum-assisted resin transfer molding process was used to manufacture the polyurethane sandwich panels. Open-edge moisture diffusion experiment was conducted for sandwich panel and its constituents by immersing each type of samples in distilled water at room temperature for nearly seven months. Moisture diffusivities and solubility for neat resin, face sheet and foam core specimens were characterized according to the experimental analysis. The moisture diffusion behavior for closed-cell polyurethane foam was found to deviate significantly from classical Fick’s law, and a multi-stage diffusion model was thus proposed to explain this deviation using a time-dependent diffusivity scheme. A user-defined subroutine was developed to implement this scheme into the commercial finite element analysis code ABAQUS. A three-dimensional dynamic finite element model was developed to predict the moisture diffusion behavior in neat resin, face sheet, foam core and sandwich specimens. This finite element model was then validated by comparing simulation results with experimental findings.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Epoxy Resin Curing Processes · Mechanical Behavior of Composites · Acoustic Wave Phenomena Research

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Mechanical and Aerospace Engineering, Missouri University of Science and Technology, Rolla, MO, USA

References (33)

Show source-provided references
1. 10.4028/www.scientific.net/AMM.291-294.117210.4028/www.scientific.net/AMM.291-294.1172 ↗
2. 10.1016/j.compstruct.2011.05.00410.1016/j.compstruct.2011.05.004 ↗
3. 10.1016/j.matdes.2012.06.02310.1016/j.matdes.2012.06.023 ↗
4. 10.4028/www.scientific.net/KEM.221-222.20910.4028/www.scientific.net/KEM.221-222.209 ↗
5. 10.1016/j.compscitech.2004.12.02810.1016/j.compscitech.2004.12.028 ↗
6. 10.1177/00219983770110010210.1177/002199837701100102 ↗
7. 10.1016/S1359-835X(96)00154-610.1016/S1359-835X(96)00154-6 ↗
8. 10.1016/j.compstruct.2004.04.05810.1016/j.compstruct.2004.04.058 ↗
9. 10.1016/j.jcis.2005.12.02310.1016/j.jcis.2005.12.023 ↗
10. 10.1016/0010-4361(94)90191-010.1016/0010-4361(94)90191-0 ↗
11. 10.1016/j.compositesb.2011.06.01610.1016/j.compositesb.2011.06.016 ↗
12. 10.1016/S0263-8223(03)00060-610.1016/S0263-8223(03)00060-6 ↗
13. 10.1016/j.compstruct.2009.03.01610.1016/j.compstruct.2009.03.016 ↗
14. 10.1007/s11340-011-9564-210.1007/s11340-011-9564-2 ↗
15. 10.1177/073168441350372010.1177/0731684413503720 ↗
16. 10.1016/j.compstruct.2009.07.00410.1016/j.compstruct.2009.07.004 ↗
17. 10.1177/00219983790130020510.1177/002199837901300205 ↗
18. 10.1177/00219983760100010110.1177/002199837601000101 ↗
19. 10.1177/073168441247018210.1177/0731684412470182 ↗
20. 10.1177/07316844860050010510.1177/073168448600500105 ↗
21. 10.1016/S0266-3538(02)00162-810.1016/S0266-3538(02)00162-8 ↗
22. 10.1520/STP34857S10.1520/STP34857S ↗
23. 10.1016/0020-7683(87)90093-X10.1016/0020-7683(87)90093-X ↗
24. 10.1177/002199830404273610.1177/0021998304042736 ↗
25. Avilés F · Polym Compos · 2010 · 31 · 71410.1002/pc.20872 ↗
26. ASTM D3171-11, 2011 · 2011
27. ASTM C272/C272M-12, 2012 · 2012
28. ASTM D5229/D5229M-12, 2012 · 2012
29. 10.1016/0032-3861(94)90730-710.1016/0032-3861(94)90730-7 ↗
30. 10.1177/0021955X730090030310.1177/0021955X7300900303 ↗
31. 10.1016/0014-3057(91)90021-F10.1016/0014-3057(91)90021-F ↗
32. 10.1109/95.62302110.1109/95.623021 ↗
33. Wong EH, Teo YC and Lim TB. Moisture diffusion and vapour pressure modeling of IC packaging. 48th IEEE Electronic Components and Technology Conference , 1998, pp. 1372-1378.