Preparation and Properties of Composite Dough-modeling Compound Reinforced Ethylene Propylene Diene Terpolymer/Silicon Rubber
Source abstract
Abstract
In this study a new method is applied to prepare a novel composite in the ethylene propylene diene terpolymer (EPDM)/silicon rubber matrix with dough-modeling compound (DMC) reinforcing. The SEM photos show that the interfacial adhesion between DMC, EPDM, and silicon rubber could be enhanced, and the compatibility and covulcanization of DMC/EPDM/silicon rubber composite are good. The influence of the DMC and peroxide on the mechanical properties and heat resistance are studied. The results show that the mechanical properties and heat resistance of the composite are good, when m DMC/m EPD/m silicon rubber is 80/25/75. The heat aging properties of the composite using equivalent dicumyl peroxide (DCP) are better than those using benzoperoxide (BPO), but Shore A hardness and elongation at break do not vary significantly. The integral properties of the DMC reinforced EPDM/silicon rubber composite has advantages over three raw materials.
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Research context
OpenAlex topics: Polymer Nanocomposites and Properties · Synthesis and properties of polymers · Fiber-reinforced polymer composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
College of Chemistry and Engineering (No.30, Wenhua Street) Qiqihar University, Qiqihar, Heilongjiang 161006, PR China,
College of Materials Science and Engineering Donghua University, Shanghai 200051, PR China
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