Modeling of Void Growth in Partial Frame Process
Source abstract
Abstract
Modeling of the void growth in Partial Frame Process (PFP) was carried out by assuming that the shrinkage due to temperature difference is compensated by the growth of void, and the results will be presented in the talk. By comparing the results with the experimental data, basic assumptions will be justified and the mechanism of the void growth will be explained in terms of the process parameters. Experimental study has also been carried out based on the design of experiments (DOE) to see the effects of the process parameters on the void growth length.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Metallurgical Processes and Thermodynamics · Aluminum Alloy Microstructure Properties · Metallurgy and Material Forming
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Chemical Engineering, Soonchunghyang University, P.O. Box 97, Asan, Korea
Cheil Industries Inc., R&D Center, Chemicals Division, 332-2 Gochun-Dong, Euiwang-Shi, Kyoungki-Do, 43 7-010 Korea
References (4)
Show source-provided references
1. 1. 1993. US Patent 5,232,654.
2. 10.1002/pen.76035110210.1002/pen.760351102 ↗
3. Johannaber, F. · 1995
4. 4. Michaeli, W. and H. Findelson. 1995. Proceedings of the 11th Annual Meeting of PPS,p.127-127.