journal article·1998-07

Modeling of Void Growth in Partial Frame Process

Dong-Hak Kim, Kyung H. Ahn

Publisher page

Abstract

Modeling of the void growth in Partial Frame Process (PFP) was carried out by assuming that the shrinkage due to temperature difference is compensated by the growth of void, and the results will be presented in the talk. By comparing the results with the experimental data, basic assumptions will be justified and the mechanism of the void growth will be explained in terms of the process parameters. Experimental study has also been carried out based on the design of experiments (DOE) to see the effects of the process parameters on the void growth length.
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Research context

OpenAlex topics: Metallurgical Processes and Thermodynamics · Aluminum Alloy Microstructure Properties · Metallurgy and Material Forming

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Affiliations

Department of Chemical Engineering, Soonchunghyang University, P.O. Box 97, Asan, Korea

Cheil Industries Inc., R&D Center, Chemicals Division, 332-2 Gochun-Dong, Euiwang-Shi, Kyoungki-Do, 43 7-010 Korea

References (4)

Show source-provided references
1. 1. 1993. US Patent 5,232,654.
2. 10.1002/pen.76035110210.1002/pen.760351102 ↗
3. Johannaber, F. · 1995
4. 4. Michaeli, W. and H. Findelson. 1995. Proceedings of the 11th Annual Meeting of PPS,p.127-127.