Adhesion Performance of Electrodeposited Ni Films with Different Treating Methods
Source abstract
Abstract
The adhesion strength between thin films has a significant effect on performance of micro-devices. It is introduced that the effects of three pre-treatment methods: acid, pulse reverse current and anodic current, on the adhesion performance of electrodeposited Ni films on Ni substrate. The adhesion strength, surface and fracture morphology of the Ni films were investigated. The dense oxide films on the Ni substrate were removed effectively by using the anodic dissolution current method in the acidic chloride solutions. Meanwhile, the Ni films treated with specific treatment conditions produced different roughness, which was responsible for the improved adhesion strength. The adhesion strength of the Ni films increased up to 629.8 MPa when substrates were treated with anodic current density of 30 mA/cm2 for 10 min, which is nearly two times higher than that of films treated by 5 vol % HCl for 10 min. The results indicate that the anodic current treatment method effectively improves the adhesion strength of Ni films.
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Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · ZnO doping and properties · Gas Sensing Nanomaterials and Sensors
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
National Demonstration Center for Experimental Materials Science and Engineering Education, Jiangsu University of Science and Technology, Zhenjiang 212003, China
Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute Micro/Nano Science and Technology, Shanghai Jiao Tong University, Shanghai 200240, China
References (21)
Show source-provided references
1. Effect of additives on microstructure and mechanical properties of nickel plate/mask fabricated by electroforming process10.1149/1.3060625 ↗
2. Fabrication and characterization of a multidirectional-sensitive contact-enhanced inertial micro-switch with an electrophoretic flexible composite fixed electrode10.1088/0960-1317/22/4/045006 ↗
3. A micro electromagnetic low level vibration energy harvester based on MEMS technology10.1007/s00542-009-0827-0 ↗
4. Adhesion strength and nucleation thermodynamics of four metals (Al, Cu, Ti, Zr) on AlN substrates10.1016/j.apsusc.2015.08.243 ↗
5. Interfacial mechanics of carbonaceous reinforcements in electrophoretically deposited nickel coatings10.1016/j.surfcoat.2016.12.039 ↗
6. Tian, W.H., Jia, J.Y., and Chen, G.Y. (2006, January 7–9). On adhesion force of MEMS micro-cantilever with rough surface. Proceedings of the 2006 IEEE International Conference on Networking, Sensing and Control, Fort Lauderdale, FL, USA.
7. High-aspect-ratio metal microchannel plates for microelectronic cooling applications10.1088/0960-1317/20/2/025004 ↗
8. Experimental study on interface strength of micro/nano-materiasls and their structures
9. Electrodeposition of Ni-Cr alloy on aluminum substrate10.1007/s11771-006-0134-1 ↗
10. Microstructure and properties of nanocrystalline nickel coatings prepared by pulse jet electrodeposition10.1016/S1003-6326(09)60254-5 ↗
11. Influence of zincate pretreatment on adhesion strength of a copper electroplating layer on AZ91 D magnesium alloy10.1016/j.surfcoat.2010.11.021 ↗
12. Potential activation phenomenon and non-cyanide direct copper plating
13. Preparation of a gradient Ti–TiOC-carbon film by electro-deposition10.1016/j.elecom.2012.01.010 ↗
14. Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrate10.1016/j.tsf.2016.01.010 ↗
15. Enhanced Adhesion of Au Films by Electrodeposition onto Porous Si10.1149/2.013311jes ↗
16. The deposition of smooth metallic molybdenum from aqueous electrolytes containing molybdate ions10.1016/j.elecom.2011.11.026 ↗
17. Pulse deposition of large area, patterned manganese oxide nanowires in variable aspect ratios without templates10.1016/j.elecom.2008.09.011 ↗
18. Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate10.1016/j.ultsonch.2015.08.020 ↗
19. Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking10.1016/j.microrel.2011.06.031 ↗
20. A novel method for improving the adhesion strength of the electrodeposited Ni films in MEMS10.1016/j.apsusc.2010.09.073 ↗
21. Initial process of pyrophosphate copper electroplating